{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,2]],"date-time":"2026-03-02T22:11:46Z","timestamp":1772489506107,"version":"3.50.1"},"reference-count":18,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"3","license":[{"start":{"date-parts":[[2026,3,1]],"date-time":"2026-03-01T00:00:00Z","timestamp":1772323200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2026,3,1]],"date-time":"2026-03-01T00:00:00Z","timestamp":1772323200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2026,3,1]],"date-time":"2026-03-01T00:00:00Z","timestamp":1772323200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62431016"],"award-info":[{"award-number":["62431016"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Circuits Syst. II"],"published-print":{"date-parts":[[2026,3]]},"DOI":"10.1109\/tcsii.2025.3650544","type":"journal-article","created":{"date-parts":[[2026,1,5]],"date-time":"2026-01-05T18:42:23Z","timestamp":1767638543000},"page":"238-242","source":"Crossref","is-referenced-by-count":0,"title":["A 3.2-mW Quad-Core CMOS Class-C VCO Achieving 197.1-dBc\/Hz Peak FoM at 0.7-V Supply"],"prefix":"10.1109","volume":"73","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-1511-142X","authenticated-orcid":false,"given":"Sheng","family":"Wang","sequence":"first","affiliation":[{"name":"National Key Laboratory of Advanced Micro and Nano Manufacture Technology and the School of Integrated Circuits, Shanghai Jiao Tong University, Shanghai, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0009-0004-7354-6597","authenticated-orcid":false,"given":"Chao","family":"Yang","sequence":"additional","affiliation":[{"name":"National Key Laboratory of Advanced Micro and Nano Manufacture Technology and the School of Integrated Circuits, Shanghai Jiao Tong University, Shanghai, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-9898-7285","authenticated-orcid":false,"given":"Jianjun","family":"Zhou","sequence":"additional","affiliation":[{"name":"National Key Laboratory of Advanced Micro and Nano Manufacture Technology and the School of Integrated Circuits, Shanghai Jiao Tong University, Shanghai, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-3584-5559","authenticated-orcid":false,"given":"Jing","family":"Jin","sequence":"additional","affiliation":[{"name":"National Key Laboratory of Advanced Micro and Nano Manufacture Technology and the School of Integrated Circuits, Shanghai Jiao Tong University, Shanghai, China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/COMST.2023.3298300"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2018.8310341"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2016.2529218"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2014.2311803"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2024.3367351"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2023.3266426"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2025.3529600"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2024.3433521"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2024.3368891"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/IMS40360.2025.11103853"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2018.2847739"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2013.2273181"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/rfic.2019.8701844"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2025.3583754"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/a-sscc60305.2024.10849131"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42615.2023.10067826"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42615.2023.10067277"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2025.3559711"}],"container-title":["IEEE Transactions on Circuits and Systems II: Express Briefs"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/8920\/11417352\/11328836.pdf?arnumber=11328836","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,3,2]],"date-time":"2026-03-02T20:58:52Z","timestamp":1772485132000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11328836\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,3]]},"references-count":18,"journal-issue":{"issue":"3"},"URL":"https:\/\/doi.org\/10.1109\/tcsii.2025.3650544","relation":{},"ISSN":["1549-7747","1558-3791"],"issn-type":[{"value":"1549-7747","type":"print"},{"value":"1558-3791","type":"electronic"}],"subject":[],"published":{"date-parts":[[2026,3]]}}}