{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,7,1]],"date-time":"2026-07-01T20:40:48Z","timestamp":1782938448705,"version":"3.54.5"},"reference-count":17,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"7","license":[{"start":{"date-parts":[[2026,7,1]],"date-time":"2026-07-01T00:00:00Z","timestamp":1782864000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2026,7,1]],"date-time":"2026-07-01T00:00:00Z","timestamp":1782864000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2026,7,1]],"date-time":"2026-07-01T00:00:00Z","timestamp":1782864000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Circuits Syst. II"],"published-print":{"date-parts":[[2026,7]]},"DOI":"10.1109\/tcsii.2026.3691068","type":"journal-article","created":{"date-parts":[[2026,5,7]],"date-time":"2026-05-07T19:56:30Z","timestamp":1778183790000},"page":"743-747","source":"Crossref","is-referenced-by-count":0,"title":["A Fully Integrated Dual-Phase Switched-Capacitor Rectifier for Piezoelectric Energy Harvesting With High Power Extraction Enhancement"],"prefix":"10.1109","volume":"73","author":[{"ORCID":"https:\/\/orcid.org\/0009-0001-4644-7751","authenticated-orcid":false,"given":"Honglei","family":"Xu","sequence":"first","affiliation":[{"name":"School of Integrated Circuits and Microelectronics, Northwestern Polytechnical University, Xi’an, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0008-7391-0650","authenticated-orcid":false,"given":"Yuzhou","family":"Mao","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits and Microelectronics, Northwestern Polytechnical University, Xi’an, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-3849-837X","authenticated-orcid":false,"given":"Quan","family":"Sun","sequence":"additional","affiliation":[{"name":"Xi’an Aerosemi Technology, Xi’an, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-9261-6088","authenticated-orcid":false,"given":"Yanzhao","family":"Ma","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits and Microelectronics, Northwestern Polytechnical University, Xi’an, China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2025.3635679"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2023.3308956"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2019.2924963"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2023.3261780"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2024.3376545"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2022.3221480"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2023.3277870"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2017.2725959"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2023.3260145"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2024.3452113"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.2989873"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2023.3261301"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.2979178"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2019.8662323"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2017.2750329"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/cicc63670.2025.10983131"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2018.8310229"}],"container-title":["IEEE Transactions on Circuits and Systems II: Express Briefs"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/8920\/11578119\/11511793.pdf?arnumber=11511793","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,7,1]],"date-time":"2026-07-01T19:39:01Z","timestamp":1782934741000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11511793\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,7]]},"references-count":17,"journal-issue":{"issue":"7"},"URL":"https:\/\/doi.org\/10.1109\/tcsii.2026.3691068","relation":{},"ISSN":["1549-7747","1558-3791"],"issn-type":[{"value":"1549-7747","type":"print"},{"value":"1558-3791","type":"electronic"}],"subject":[],"published":{"date-parts":[[2026,7]]}}}