{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,8,4]],"date-time":"2026-08-04T05:44:05Z","timestamp":1785822245429,"version":"3.56.0"},"reference-count":19,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"8","license":[{"start":{"date-parts":[[2026,8,1]],"date-time":"2026-08-01T00:00:00Z","timestamp":1785542400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2026,8,1]],"date-time":"2026-08-01T00:00:00Z","timestamp":1785542400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2026,8,1]],"date-time":"2026-08-01T00:00:00Z","timestamp":1785542400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"name":"National Research Foundation of Korea (NRF) grant funded by Korean Government [Ministry of Science and ICT (MSIT)]","award":["RS-2026-25478299"],"award-info":[{"award-number":["RS-2026-25478299"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Circuits Syst. II"],"published-print":{"date-parts":[[2026,8]]},"DOI":"10.1109\/tcsii.2026.3709987","type":"journal-article","created":{"date-parts":[[2026,7,3]],"date-time":"2026-07-03T19:55:34Z","timestamp":1783108534000},"page":"838-842","source":"Crossref","is-referenced-by-count":0,"title":["A\n                    <i>Q<\/i>\n                    -Band High-Power SiGe HBT Doherty Power Amplifier Leveraging 8-Shaped Inductor-Embedded Ultra Compact Doherty Passive Network"],"prefix":"10.1109","volume":"73","author":[{"ORCID":"https:\/\/orcid.org\/0000-0001-7159-5468","authenticated-orcid":false,"given":"Byeongcheol","family":"Yoon","sequence":"first","affiliation":[{"name":"Hanyang University","place":["Ansan, South Korea"],"department":["Department of Electrical Engineering"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0007-7673-2784","authenticated-orcid":false,"given":"Seung-Pyo","family":"Han","sequence":"additional","affiliation":[{"name":"Ajou University","place":["Suwon, South Korea"],"department":["Department of Intelligence Semiconductor Engineering"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-9424-3377","authenticated-orcid":false,"given":"Junghyun","family":"Kim","sequence":"additional","affiliation":[{"name":"Hanyang University","place":["Ansan, South Korea"],"department":["Department of Electrical Engineering"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-9362-5506","authenticated-orcid":false,"given":"Inchan","family":"Ju","sequence":"additional","affiliation":[{"name":"Ajou University","place":["Suwon, South Korea"],"department":["Department of Electrical and Computer Engineering"]}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/JSTSP.2016.2523924"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/MMM.2019.2941632"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2024.3507175"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2014.2387061"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2021.3070800"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2023.3311954"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2021.3064022"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2024.3415010"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2022.3148044"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2025.3626463"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2021.3068473"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2022.3186304"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2025.3591776"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2023.3238766"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2021.3078322"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2902307"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/isscc49657.2024.10454406"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC49663.2026.11409346"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2018.2846029"}],"container-title":["IEEE Transactions on Circuits and Systems II: Express Briefs"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/8920\/11635955\/11594997.pdf?arnumber=11594997","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,8,4]],"date-time":"2026-08-04T04:48:21Z","timestamp":1785818901000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11594997\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,8]]},"references-count":19,"journal-issue":{"issue":"8"},"URL":"https:\/\/doi.org\/10.1109\/tcsii.2026.3709987","relation":{},"ISSN":["1549-7747","1558-3791"],"issn-type":[{"value":"1549-7747","type":"print"},{"value":"1558-3791","type":"electronic"}],"subject":[],"published":{"date-parts":[[2026,8]]}}}