{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,29]],"date-time":"2026-01-29T22:40:14Z","timestamp":1769726414929,"version":"3.49.0"},"reference-count":39,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"6","license":[{"start":{"date-parts":[[2021,11,1]],"date-time":"2021-11-01T00:00:00Z","timestamp":1635724800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"}],"funder":[{"name":"ProcessIT Innovations and the Celtic Plus Project SENDATE-Extend"},{"name":"Swedish Research Council Norrbottens Forskningsr\u00e5d Project DISTRACT to acquire the liquid cooling parts"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Contr. Syst. Technol."],"published-print":{"date-parts":[[2021,11]]},"DOI":"10.1109\/tcst.2019.2942270","type":"journal-article","created":{"date-parts":[[2020,12,1]],"date-time":"2020-12-01T22:03:26Z","timestamp":1606860206000},"page":"2325-2338","source":"Crossref","is-referenced-by-count":15,"title":["Controlled Direct Liquid Cooling of Data Servers"],"prefix":"10.1109","volume":"29","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-7443-8174","authenticated-orcid":false,"given":"Riccardo","family":"Lucchese","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Damiano","family":"Varagnolo","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-8893-4809","authenticated-orcid":false,"given":"Andreas","family":"Johansson","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref39","year":"2019","journal-title":"Open Compute Project"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1016\/j.applthermaleng.2017.02.001"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/ITHERM.2006.1645343"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1016\/S0017-9310(02)00443-X"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/95.588554"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1002\/aic.690320215"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.5098\/hmt.v1.2.3006"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijheatmasstransfer.2009.11.012"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1115\/1.4001306"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijheatfluidflow.2010.03.001"},{"key":"ref10","author":"vertal","year":"2016","journal-title":"Liquid cooling technology update"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1115\/IHTC14-23352"},{"key":"ref12","doi-asserted-by":"crossref","first-page":"434","DOI":"10.1080\/01457632.2012.721316","article-title":"Advances in electronics cooling","volume":"34","author":"marcinichen","year":"2016","journal-title":"Heat Transf Eng"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2008.52"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1115\/InterPACK2009-89074"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2011.2161244"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1016\/j.conengprac.2019.05.019"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/ITHERM.2010.5501426"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1016\/j.applthermaleng.2011.12.008"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1504\/IJHPCN.2016.076269"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1115\/DSCC2016-9782"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1016\/j.energy.2012.04.037"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/TCST.2015.2415411"},{"key":"ref3","article-title":"Exascale computing study: Technology challenges in achieving exascale systems","author":"bergman","year":"2008","journal-title":"Defense Adv Res Projects Agency Inf Process"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1016\/j.rser.2014.11.056"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1021\/ie010389e"},{"key":"ref5","first-page":"1","article-title":"A vision of energy aware computing from chips to data centers","author":"patel","year":"2003","journal-title":"Proc Int Symp Micro-Mech Eng"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ITHERM.2012.6231424"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1147\/JRD.2009.5429024"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1080\/01457630601117799"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ITHERM.2016.7517615"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/MAHC.2010.28"},{"key":"ref20","first-page":"249","article-title":"Coordinating liquid and free air cooling with workload allocation for data center power minimization","author":"li","year":"2014","journal-title":"Proc IEEE Int Conf Autonomic Comput"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1145\/980152.980157"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/IGCC.2014.7039163"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/VLSISOC.2009.6041327"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1007\/s00542-008-0690-4"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1016\/j.enbuild.2011.09.022"},{"key":"ref25","article-title":"Thermal modeling and management of liquid-cooled 3D stacked architectures","author":"co?kun","year":"2011","journal-title":"VLSI-SoC Technologies for Systems Integration"}],"container-title":["IEEE Transactions on Control Systems Technology"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/87\/9565135\/09274383.pdf?arnumber=9274383","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,1,12]],"date-time":"2022-01-12T16:05:13Z","timestamp":1642003513000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9274383\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2021,11]]},"references-count":39,"journal-issue":{"issue":"6"},"URL":"https:\/\/doi.org\/10.1109\/tcst.2019.2942270","relation":{},"ISSN":["1063-6536","1558-0865","2374-0159"],"issn-type":[{"value":"1063-6536","type":"print"},{"value":"1558-0865","type":"electronic"},{"value":"2374-0159","type":"electronic"}],"subject":[],"published":{"date-parts":[[2021,11]]}}}