{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,2,21]],"date-time":"2025-02-21T10:18:44Z","timestamp":1740133124781,"version":"3.37.3"},"reference-count":21,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"12","license":[{"start":{"date-parts":[[2017,12,1]],"date-time":"2017-12-01T00:00:00Z","timestamp":1512086400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"}],"funder":[{"DOI":"10.13039\/100007567","name":"CityU Internal Grant, City University of Hong Kong","doi-asserted-by":"publisher","award":["CityU 7004440"],"award-info":[{"award-number":["CityU 7004440"]}],"id":[{"id":"10.13039\/100007567","id-type":"DOI","asserted-by":"publisher"}]},{"name":"Croucher Startup Allowance","award":["9500015"],"award-info":[{"award-number":["9500015"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Circuits Syst. Video Technol."],"published-print":{"date-parts":[[2017,12]]},"DOI":"10.1109\/tcsvt.2016.2593618","type":"journal-article","created":{"date-parts":[[2016,7,20]],"date-time":"2016-07-20T14:24:33Z","timestamp":1469024673000},"page":"2702-2713","source":"Crossref","is-referenced-by-count":18,"title":["A Fully Pipelined Hardware Architecture for Intra Prediction of HEVC"],"prefix":"10.1109","volume":"27","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-9296-4063","authenticated-orcid":false,"given":"Biao","family":"Min","sequence":"first","affiliation":[]},{"given":"Zhe","family":"Xu","sequence":"additional","affiliation":[]},{"given":"Ray C. C.","family":"Cheung","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2005.858748"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.7873\/DATE.2013.039"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TCSVT.2015.2428571"},{"key":"ref13","first-page":"373","article-title":"An efficient VLSI architecture for $4\\times 4$ intra prediction in the High Efficiency Video Coding (HEVC) standard","author":"li","year":"2011","journal-title":"Proc IEEE ICIP"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/ICIP.2012.6466830"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2013.2275571"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TCSVT.2015.2409019"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TCE.2014.6937333"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TCSVT.2015.2469113"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TCSVT.2013.2276862"},{"key":"ref4","doi-asserted-by":"crossref","first-page":"92170u","DOI":"10.1117\/12.2065561","article-title":"Comparison of compression efficiency between HEVC\/H.265 and VP9 based on subjective assessments","volume":"9217","author":"rerabek","year":"2014","journal-title":"Proc SPIE"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/PCS.2013.6737765"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TCSVT.2012.2223011"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TCSVT.2012.2221255"},{"key":"ref8","doi-asserted-by":"crossref","first-page":"892","DOI":"10.1109\/TCSVT.2014.2363739","article-title":"A fast CU size decision algorithm for the HEVC intra encoder","volume":"25","author":"min","year":"2015","journal-title":"IEEE Trans Circuits Syst Video Technol"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TCSVT.2012.2221525"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TCSVT.2012.2221191"},{"key":"ref1","doi-asserted-by":"crossref","first-page":"560","DOI":"10.1109\/TCSVT.2003.815165","article-title":"overview of the h.264\/avc video coding standard","volume":"13","author":"wiegand","year":"2003","journal-title":"IEEE Transactions on Circuits and Systems for Video Technology"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TCSVT.2013.2249017"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2013.2295116"},{"volume":"1","journal-title":"Stratix v Device Handbook Volume 1 Device Interfaces and Integration","year":"2012","key":"ref21"}],"container-title":["IEEE Transactions on Circuits and Systems for Video Technology"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/76\/8186326\/07517220.pdf?arnumber=7517220","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,1,12]],"date-time":"2022-01-12T11:41:45Z","timestamp":1641987705000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7517220\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2017,12]]},"references-count":21,"journal-issue":{"issue":"12"},"URL":"https:\/\/doi.org\/10.1109\/tcsvt.2016.2593618","relation":{},"ISSN":["1051-8215","1558-2205"],"issn-type":[{"type":"print","value":"1051-8215"},{"type":"electronic","value":"1558-2205"}],"subject":[],"published":{"date-parts":[[2017,12]]}}}