{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,11,1]],"date-time":"2025-11-01T09:27:53Z","timestamp":1761989273195,"version":"3.37.3"},"reference-count":46,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"10","license":[{"start":{"date-parts":[[2019,10,1]],"date-time":"2019-10-01T00:00:00Z","timestamp":1569888000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2019,10,1]],"date-time":"2019-10-01T00:00:00Z","timestamp":1569888000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2019,10,1]],"date-time":"2019-10-01T00:00:00Z","timestamp":1569888000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"name":"National Council for Scientific and Technological Development (CNPq) of Brazil"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Circuits Syst. Video Technol."],"published-print":{"date-parts":[[2019,10]]},"DOI":"10.1109\/tcsvt.2018.2870825","type":"journal-article","created":{"date-parts":[[2018,9,17]],"date-time":"2018-09-17T18:41:26Z","timestamp":1537209686000},"page":"3046-3060","source":"Crossref","is-referenced-by-count":7,"title":["Hybrid Scratchpad Video Memory Architecture for Energy-Efficient Parallel HEVC"],"prefix":"10.1109","volume":"29","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-5700-2221","authenticated-orcid":false,"given":"Felipe M.","family":"Sampaio","sequence":"first","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0002-8045-957X","authenticated-orcid":false,"given":"Bruno","family":"Zatt","sequence":"additional","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0002-2607-8135","authenticated-orcid":false,"given":"Muhammad","family":"Shafique","sequence":"additional","affiliation":[]},{"given":"Jorg","family":"Henkel","sequence":"additional","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0002-9018-6309","authenticated-orcid":false,"given":"Sergio","family":"Bampi","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.1145\/2627369.2627615"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2014.7001343"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1049\/iet-cds.2016.0267"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/ICCE-Berlin.2016.7684724"},{"key":"ref31","first-page":"1","article-title":"Software architecture of High Efficiency Video Coding for many-core systems with power-efficient workload balancing","author":"khan","year":"2014","journal-title":"Proc Conf Design Autom Test Eur (DATE)"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/ICIP.2014.7025250"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2013.6691150"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1109\/ICCD.2015.7357185"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1109\/TCSVT.2016.2638857"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2015.7168707"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/76.981846"},{"journal-title":"CACTI HP Labs","year":"2008","key":"ref40"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TCSVT.2006.871388"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2011.6105303"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1145\/2024724.2024950"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.7873\/DATE.2013.144"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1145\/2228360.2228516"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1145\/774789.774805"},{"journal-title":"TMS370CX7X from Texas Instruments","year":"2017","key":"ref17"},{"journal-title":"The Cell Project","year":"2013","key":"ref18"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1145\/2333660.2333712"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/TMM.2016.2600439"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TCSVT.2012.2221191"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/PCS.2013.6737714"},{"key":"ref3","first-page":"1","article-title":"dSVM: Energy-efficient distributed scratchpad video memory architecture for the next-generation high efficiency video coding","author":"sampaio","year":"2014","journal-title":"Proc Conf Design Autom Test Eur (DATE)"},{"journal-title":"Valgrind Home","year":"2017","key":"ref6"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/TCSVT.2012.2223056"},{"journal-title":"High Efficiency Video Coding (HEVC) Test Model 1 (HM 1) Encoder Description","year":"2018","key":"ref5"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2012.2231013"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/JSTSP.2013.2271451"},{"journal-title":"Advanced video coding for generic audiovisual services","year":"2013","key":"ref2"},{"article-title":"Multi-copy cache: A highly energy efficient cache architecture","year":"2010","author":"chakraborty","key":"ref9"},{"journal-title":"High Efficiency Video Coding (HEVC) Text Specification Draft 10","year":"2013","key":"ref1"},{"journal-title":"Common Test Conditions and Software Reference Configurations","year":"2012","key":"ref46"},{"journal-title":"Read-Tuned STT-RAM and eDRAM Cache Hierarchies for Throughput and Energy Enhancement","year":"2016","author":"khoshavi","key":"ref20"},{"journal-title":"TN-46-03 Calculating DDR Memory System Power","year":"2001","key":"ref45"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2016.2620168"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2015.2435772"},{"key":"ref42","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2007.904101"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/TCSVT.2012.2223411"},{"key":"ref41","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2012.2185930"},{"journal-title":"Semiconductor Engineering Four Foundries Back MRAM","year":"2017","author":"lapedus","key":"ref23"},{"journal-title":"TN-46-12 Mobile DRAM Power-Saving Features\/Calculations","year":"2005","key":"ref44"},{"key":"ref26","doi-asserted-by":"crossref","first-page":"554","DOI":"10.1145\/1391469.1391610","article-title":"circuit and microarchitecture evaluation of 3d stacking magnetic ram (mram) as a universal memory replacement","author":"xiangyu dong","year":"2008","journal-title":"2008 45th ACM\/IEEE Design Automation Conference DAC"},{"journal-title":"4Gb x16 x32 Mobile LPDDR2 SDRAM S4","year":"2011","key":"ref43"},{"journal-title":"Memory Systems Cache DRAM Disk","year":"2010","author":"jacob","key":"ref25"}],"container-title":["IEEE Transactions on Circuits and Systems for Video Technology"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/76\/8855034\/08466911.pdf?arnumber=8466911","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,7,13]],"date-time":"2022-07-13T21:12:04Z","timestamp":1657746724000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8466911\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,10]]},"references-count":46,"journal-issue":{"issue":"10"},"URL":"https:\/\/doi.org\/10.1109\/tcsvt.2018.2870825","relation":{},"ISSN":["1051-8215","1558-2205"],"issn-type":[{"type":"print","value":"1051-8215"},{"type":"electronic","value":"1558-2205"}],"subject":[],"published":{"date-parts":[[2019,10]]}}}