{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,8]],"date-time":"2026-02-08T11:40:45Z","timestamp":1770550845672,"version":"3.49.0"},"reference-count":59,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"3","license":[{"start":{"date-parts":[[2020,3,1]],"date-time":"2020-03-01T00:00:00Z","timestamp":1583020800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2020,3,1]],"date-time":"2020-03-01T00:00:00Z","timestamp":1583020800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2020,3,1]],"date-time":"2020-03-01T00:00:00Z","timestamp":1583020800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100002322","name":"Coordena\u00e7\u00e3o de Aperfei\u00e7oamento de Pessoal de N\u00edvel Superior","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100002322","id-type":"DOI","asserted-by":"publisher"}]},{"name":"Brazilian research support agencies CNPq and FAPERGS"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Circuits Syst. Video Technol."],"published-print":{"date-parts":[[2020,3]]},"DOI":"10.1109\/tcsvt.2019.2898122","type":"journal-article","created":{"date-parts":[[2019,2,7]],"date-time":"2019-02-07T21:04:32Z","timestamp":1549573472000},"page":"850-861","source":"Crossref","is-referenced-by-count":43,"title":["Fast 3D-HEVC Depth Map Encoding Using Machine Learning"],"prefix":"10.1109","volume":"30","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-6771-6359","authenticated-orcid":false,"given":"Mario","family":"Saldanha","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-8399-3014","authenticated-orcid":false,"given":"Gustavo","family":"Sanchez","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-7811-7896","authenticated-orcid":false,"given":"Cesar","family":"Marcon","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-3421-5830","authenticated-orcid":false,"given":"Luciano","family":"Agostini","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.1109\/TMM.2016.2525010"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1109\/ICASSP.2018.8462283"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/TIP.2016.2601264"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/ICIP.2014.7025649"},{"key":"ref31","first-page":"1","article-title":"Fast single depth intra mode decision for depth map coding in 3D-HEVC","author":"kim","year":"2015","journal-title":"Proc IEEE Int Conf Multimedia Expo Workshops (ICMEW)"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/MMSP.2015.7340849"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1109\/ITS.2014.6947999"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1109\/JETCAS.2016.2597698"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1109\/ICIP.2014.7025835"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/TCSVT.2014.2363753"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/EUVIP.2016.7764607"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/ICDSP.2015.7251918"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/APSIPA.2015.7415297"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TCSVT.2012.2221191"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TMM.2018.2790162"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1016\/j.jvcir.2017.05.006"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/ICIP.2016.7532533"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1016\/j.jvcir.2017.03.004"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/TCSVT.2013.2283110"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/ICASSP.2016.7471923"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/TCSVT.2016.2612693"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/TCSVT.2016.2617332"},{"key":"ref50","author":"zhang","year":"2011","journal-title":"Ghost town fly 3DV sequence for purposes of 3DV standardization"},{"key":"ref51","author":"doma\u00f1ski","year":"2009","journal-title":"Poznan Multiview Video Test Sequences and Camera Parameters"},{"key":"ref59","first-page":"1","article-title":"Calculation of average PSNR differences between RD-Curves","author":"bjontegaard","year":"2001","journal-title":"Proc VCEG Meeting"},{"key":"ref58","doi-asserted-by":"publisher","DOI":"10.1016\/B978-1-55860-200-7.50080-5"},{"key":"ref57","author":"quinlan","year":"1993","journal-title":"C4 5 Programs for Machine Learning"},{"key":"ref56","doi-asserted-by":"publisher","DOI":"10.1145\/1656274.1656278"},{"key":"ref55","doi-asserted-by":"publisher","DOI":"10.5244\/C.2.23"},{"key":"ref54","first-page":"1","article-title":"A Quad-Tree and Statistics based fast CU Depth decision algorithm for 3D-HEVC","author":"chi","year":"2014","journal-title":"Proc IEEE Int Conf Multimedia Expo Workshops (ICMEW)"},{"key":"ref53","year":"2018","journal-title":"National Institute of Information and Communication Technology (NICT)"},{"key":"ref52","author":"rusanovskyy","year":"2011","journal-title":"Undo dancer 3DV sequence for purposes of 3DV standardization"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2015.7168710"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TMM.2013.2284751"},{"key":"ref40","doi-asserted-by":"publisher","DOI":"10.1109\/JSTSP.2013.2283657"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TMM.2011.2169238"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TMM.2015.2400823"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TCSVT.2015.2407791"},{"key":"ref15","author":"lee","year":"2015","journal-title":"3D-CE1 Depth Intra Skip (DIS) Mode"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/ICIP.2014.7025651"},{"key":"ref17","year":"2018","journal-title":"3D-HEVC Test Model"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TIP.2018.2837379"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1007\/s11045-016-0388-1"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TCSVT.2015.2477935"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TIP.2013.2264820"},{"key":"ref6","doi-asserted-by":"crossref","first-page":"892","DOI":"10.1109\/TCSVT.2014.2363739","article-title":"A fast CU size decision algorithm for the HEVC intra encoder","volume":"25","author":"min","year":"2015","journal-title":"IEEE Trans Circuits Syst Video Technol"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TCSVT.2013.2290578"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TCSVT.2014.2313892"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TCSVT.2014.2360031"},{"key":"ref49","author":"ho","year":"2008","journal-title":"Multiview Video Test Sequence and Camera Parameters"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1016\/j.image.2006.11.013"},{"key":"ref46","doi-asserted-by":"publisher","DOI":"10.1016\/S0167-739X(97)00021-6"},{"key":"ref45","year":"2005","journal-title":"Advanced video coding for generic audiovisual services"},{"key":"ref48","year":"2018","journal-title":"Tanimoto laboratory"},{"key":"ref47","author":"m\u00fcller","year":"2014","journal-title":"Common Test Conditions of 3DV Core Experiments"},{"key":"ref42","first-page":"101","article-title":"New bi-prediction techniques for B pictures coding","author":"ji","year":"2004","journal-title":"Proc IEEE Int Conf Multimedia Expo (ICME)"},{"key":"ref41","doi-asserted-by":"publisher","DOI":"10.1109\/TCSVT.2018.2865645"},{"key":"ref44","doi-asserted-by":"publisher","DOI":"10.1109\/PCS.2013.6737770"},{"key":"ref43","doi-asserted-by":"publisher","DOI":"10.1109\/TCSVT.2012.2223051"}],"container-title":["IEEE Transactions on Circuits and Systems for Video Technology"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/76\/9025308\/08636965.pdf?arnumber=8636965","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,4,27]],"date-time":"2022-04-27T14:39:15Z","timestamp":1651070355000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8636965\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2020,3]]},"references-count":59,"journal-issue":{"issue":"3"},"URL":"https:\/\/doi.org\/10.1109\/tcsvt.2019.2898122","relation":{},"ISSN":["1051-8215","1558-2205"],"issn-type":[{"value":"1051-8215","type":"print"},{"value":"1558-2205","type":"electronic"}],"subject":[],"published":{"date-parts":[[2020,3]]}}}