{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,30]],"date-time":"2026-04-30T18:48:31Z","timestamp":1777574911135,"version":"3.51.4"},"reference-count":34,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"5","license":[{"start":{"date-parts":[[2025,9,1]],"date-time":"2025-09-01T00:00:00Z","timestamp":1756684800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2025,9,1]],"date-time":"2025-09-01T00:00:00Z","timestamp":1756684800000},"content-version":"am","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2025,9,1]],"date-time":"2025-09-01T00:00:00Z","timestamp":1756684800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,9,1]],"date-time":"2025-09-01T00:00:00Z","timestamp":1756684800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/100000015","name":"U.S. Department of Energy","doi-asserted-by":"publisher","award":["DE-EE0009046"],"award-info":[{"award-number":["DE-EE0009046"]}],"id":[{"id":"10.13039\/100000015","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Dependable and Secure Comput."],"published-print":{"date-parts":[[2025,9]]},"DOI":"10.1109\/tdsc.2025.3573652","type":"journal-article","created":{"date-parts":[[2025,6,2]],"date-time":"2025-06-02T14:04:59Z","timestamp":1748873099000},"page":"5760-5772","source":"Crossref","is-referenced-by-count":1,"title":["AVOID: Automated Void Detection in STL Files"],"prefix":"10.1109","volume":"22","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-0372-7953","authenticated-orcid":false,"given":"Sarah","family":"Roscoe","sequence":"first","affiliation":[{"name":"School of Computing, University of Nebraska-Lincoln, Lincoln, NE, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Logan","family":"Hellbusch","sequence":"additional","affiliation":[{"name":"School of Computing, University of Nebraska-Lincoln, Lincoln, NE, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Chamath","family":"Gunawardena","sequence":"additional","affiliation":[{"name":"Electrical and Computer Engineering Department, University of Nebraska-Lincoln, Lincoln, NE, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-6402-2549","authenticated-orcid":false,"given":"Jitender S.","family":"Deogun","sequence":"additional","affiliation":[{"name":"School of Computing, University of Nebraska-Lincoln, Lincoln, NE, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Witawas","family":"Srisa-An","sequence":"additional","affiliation":[{"name":"School of Computing, University of Nebraska-Lincoln, Lincoln, NE, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-5671-916X","authenticated-orcid":false,"given":"Yi","family":"Qian","sequence":"additional","affiliation":[{"name":"Electrical and Computer Engineering Department, University of Nebraska-Lincoln, Lincoln, NE, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Gabriela","family":"Ciocarlie","sequence":"additional","affiliation":[{"name":"Cybersecurity Manufacturing Innovation Institute (CyManII), San Antonio, TX, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1038\/s41746-019-0161-6"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.2139\/ssrn.3823296"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/MC.2020.2997322"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-030-96314-9_6"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TMECH.2022.3179713"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1145\/3313991.3314003"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-031-20752-5_19"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1016\/j.engfailanal.2022.106272"},{"key":"ref9","article-title":"Dr0wned \u2013 Cyber-physical attack with additive manufacturing","volume-title":"Proc. 11th USENIX Workshop Offensive Technol.","author":"Belikovetsky"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1016\/j.jmsy.2017.05.007"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1145\/3264918"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1145\/3471621.3471843"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1002\/adem.201900146"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1016\/j.jmsy.2020.05.014"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2019.2928005"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1080\/0951192X.2020.1736711"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/DSN48987.2021.00060"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1007\/s10845-021-01879-9"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1016\/j.addma.2020.101232"},{"key":"ref20","article-title":"Additive manufacturing, ISO\/ASTM 52900:2021(en)","year":"2021"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1146\/annurev-matsci-070115-031606"},{"key":"ref22","article-title":"Trimesh","author":"Dawson-Haggerty","year":"2022"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.4135\/9781473960367.n239"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/MSP.2011.67"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/ICRA40945.2020.9197416"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1007\/s10845-017-1315-5"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1145\/3485832.3485904"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1016\/j.compscitech.2013.09.019"},{"key":"ref29","article-title":"Thingiverse - Digital designs for physical objects","year":"2025"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1016\/j.procs.2021.12.319"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1145\/3243734.3243735"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1016\/j.fsidi.2023.301510"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1145\/3564625.3567996"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1145\/3564625.3564649"}],"container-title":["IEEE Transactions on Dependable and Secure Computing"],"original-title":[],"link":[{"URL":"https:\/\/ieeexplore.ieee.org\/ielam\/8858\/11150357\/11021259-aam.pdf","content-type":"application\/pdf","content-version":"am","intended-application":"syndication"},{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/8858\/11150357\/11021259.pdf?arnumber=11021259","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,9,4]],"date-time":"2025-09-04T18:52:42Z","timestamp":1757011962000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11021259\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,9]]},"references-count":34,"journal-issue":{"issue":"5"},"URL":"https:\/\/doi.org\/10.1109\/tdsc.2025.3573652","relation":{},"ISSN":["1545-5971","1941-0018","2160-9209"],"issn-type":[{"value":"1545-5971","type":"print"},{"value":"1941-0018","type":"electronic"},{"value":"2160-9209","type":"electronic"}],"subject":[],"published":{"date-parts":[[2025,9]]}}}