{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,4]],"date-time":"2026-04-04T15:01:08Z","timestamp":1775314868716,"version":"3.50.1"},"reference-count":69,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","license":[{"start":{"date-parts":[[2024,1,1]],"date-time":"2024-01-01T00:00:00Z","timestamp":1704067200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2024,1,1]],"date-time":"2024-01-01T00:00:00Z","timestamp":1704067200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,1,1]],"date-time":"2024-01-01T00:00:00Z","timestamp":1704067200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Eng. Manage."],"published-print":{"date-parts":[[2024]]},"DOI":"10.1109\/tem.2024.3406427","type":"journal-article","created":{"date-parts":[[2024,6,21]],"date-time":"2024-06-21T17:39:51Z","timestamp":1718991591000},"page":"11238-11252","source":"Crossref","is-referenced-by-count":22,"title":["Toward Industry 6.0 and Society 6.0: The Quintuple Innovation Helix With Embedded AI Modalities as Enabler of Public Interest Technologies Strategic Technology Management and Road-Mapping"],"prefix":"10.1109","volume":"71","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-2348-4311","authenticated-orcid":false,"given":"Elias G.","family":"Carayannis","sequence":"first","affiliation":[{"name":"School of Business, George Washington University, Washington, DC, USA"}]},{"given":"Thorsten","family":"Posselt","sequence":"additional","affiliation":[{"name":"University of Leipzig and Fraunhofer IMW, Leipzig, Germany"}]},{"ORCID":"https:\/\/orcid.org\/0009-0009-2419-9660","authenticated-orcid":false,"given":"Steffen","family":"Preissler","sequence":"additional","affiliation":[{"name":"University of Leipzig and Fraunhofer IMW, Leipzig, Germany"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1111\/radm.12300"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1201\/9781420037364"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/HICSS.1996.495338"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1016\/S0166-4972(01)00047-5"},{"key":"ref5","article-title":"The new Earth initiative","author":"Carayannis","year":"2022"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/tem.2019.2909909"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1186\/s13731-014-0012-2"},{"key":"ref8","article-title":"The open innovation paradigm and strategic options for EU-US innovation","author":"Carayannis","year":"2011"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ethics57328.2023.10154964"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1057\/9781137354372"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/tem.2022.3159373"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1186\/2192-5372-1-2"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1016\/S0166-4972(98)00101-1"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/tem.2022.3144881"},{"key":"ref17","article-title":"Society 5.0. A people-centric super-smart society","author":"Deguchi","year":"2020"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1007\/s13132-021-00854-2"},{"key":"ref19","article-title":"Public interest technologies","author":"Carayannis","year":"2023"},{"key":"ref20","article-title":"GWU EMTECH lectures, 2010-2022 and dupont summit series lecture","author":"Carayannis","year":"2023"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/tem.2021.3096012"},{"key":"ref22","article-title":"Carayannis lecture on PIT","author":"Carayannis","year":"2023"},{"key":"ref23","volume-title":"Mikroelektronik. Vertrauenswrdig und Nachhaltig","year":"2022"},{"key":"ref24","article-title":"Federal ministry of education and research","year":"2023","journal-title":"Memorandum Laser Inertial Fusion Energy"},{"key":"ref25","article-title":"Knstliche Intelligenz","year":"2023"},{"key":"ref26","article-title":"Strategies to lead in the semiconductor world","author":"Burkacky","year":"2022"},{"key":"ref27","article-title":"Other governance structures are: SEMATECH"},{"key":"ref28","article-title":"Study on the electronics ecosystem  overview, developments and Europes position in the world","year":"2020"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.2139\/ssrn.4434172"},{"key":"ref30","article-title":"Today in the lab  tomorrow in energy","year":"2020"},{"key":"ref31","article-title":"Decadal plan for semiconductors","year":"2021"},{"key":"ref33","article-title":"Fusionsforschung muss gestrkt werden","year":"2023"},{"key":"ref34","article-title":"Bayerischer Masterplan zur Frderung der Kernfusion und neuartiger Kerntechnologien","year":"2023"},{"key":"ref35","article-title":"Nationale Strategie fr knstliche Intelligenz. AI Made in Germany","year":"2020"},{"key":"ref36","article-title":"Eckpunkte KI-Aktionsplan: Spitzenposition fr Deutschland und Europa","year":"2023"},{"key":"ref37","article-title":"Einsatz von Knstlicher Intelligenz in der Deutschen Wirtschaft","year":"2020"},{"key":"ref38","article-title":"BMBF-Aktionsplan Knstliche Intelligenz","year":"2023"},{"key":"ref39","article-title":"Richtlinie zur Frderung des Innovationswettbewerbs Elektronik fr energiesparsame Informations- und Kommunikationstechnik im Rahmen der Initiative Green ICT","year":"2020"},{"key":"ref41","article-title":"Eckpunkte fr mittel- und langfristige Entwicklungen des Halbleiterkosystems in Deutschland und Europa","year":"2022"},{"key":"ref42","article-title":"Semiconductor Strategy for Germany and Europe.","year":"2023"},{"key":"ref43","article-title":"Positionspapier Fusionsforschung","year":"2023"},{"key":"ref44","article-title":"Untersuchung der Sicherheit von Kernfusionskraftwerken hinsichtlich nuklearer Str- und Unflle","year":"2013"},{"key":"ref45","article-title":"DISKUSSIONSPAPIERE. Kernfusion: Eine Option fr Energiesicherheit und Klimaschutz in Deutschland","year":"2023"},{"key":"ref46","article-title":"KI-Strategie fr den Freistaat Sachsen","year":"2023"},{"key":"ref47","article-title":"Mit KI den nachhaltigen Wandel gestalten","year":"2022"},{"key":"ref55","article-title":"State aid: Commission approves plan by France, Germany, Italy and the U.K. to give \u20ac1,75 billion pubic support to joint research and innovation project in microelectronics","year":"2018"},{"key":"ref56","article-title":"Fraunhofer ENAS: FMD and Intel further expand their cooperation","year":"2023"},{"key":"ref57","article-title":"Leading European industries to build fusion power plants","year":"2023"},{"key":"ref58","article-title":"Experten: Fusionsforschung muss gestrkt werden","year":"2023"},{"key":"ref59","article-title":"The future is fusion","year":"2023"},{"key":"ref60","article-title":"The roadmap to fusion energy","year":"2023"},{"key":"ref61","article-title":"Nationale Strategie fr knstliche Intelligenz. AI Made in Germany","year":"2020"},{"key":"ref62","article-title":"Shaping Europes digital future","year":"2024"},{"key":"ref63","article-title":"Nationale Strategie fr knstliche Intelligenz. AI Made in Germany","year":"2020"},{"key":"ref64","article-title":"Shaping Europes digital future","year":"2024"},{"key":"ref65","article-title":"Warum das Start-up aus Mnchen in die USA zieht","year":"2023"},{"key":"ref66","article-title":"Fusions-start-ups bndeln Krfte","year":"2023"},{"key":"ref67","doi-asserted-by":"publisher","DOI":"10.1504\/IJIRD.2008.016861"},{"key":"ref68","doi-asserted-by":"publisher","DOI":"10.1016\/j.techfore.2017.03.008"},{"key":"ref69","doi-asserted-by":"publisher","DOI":"10.1109\/ethics57328.2023.10155014"},{"key":"ref70","doi-asserted-by":"publisher","DOI":"10.1109\/ICESC57686.2023.10193059"},{"key":"ref71","article-title":"SCANGINEERING  3D-Scanning  Reverse Engineering.","year":"2024"},{"key":"ref72","article-title":"3D scanning.","year":"2024"},{"key":"ref73","article-title":"3D measurement.","year":"21, 20240"},{"key":"ref74","article-title":"Additive manufacturing.","year":"2024"},{"key":"ref75","article-title":"Micro- and biosystems engineering.","year":"2024"},{"key":"ref76","article-title":"Additive manufacturing technologies.","year":"2024"},{"key":"ref77","article-title":"Cyber-physical systems: Securing the Internet of Things.","year":"2024"},{"key":"ref78","article-title":"Smart sensorik.","year":"2024"},{"key":"ref79","article-title":"Condition monitoring and predictive maintenance.","year":"2024"},{"key":"ref80","doi-asserted-by":"publisher","DOI":"10.1016\/S0166-4972(98)00065-0"}],"container-title":["IEEE Transactions on Engineering Management"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/17\/10339242\/10568419.pdf?arnumber=10568419","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,2,5]],"date-time":"2025-02-05T19:03:44Z","timestamp":1738782224000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10568419\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024]]},"references-count":69,"URL":"https:\/\/doi.org\/10.1109\/tem.2024.3406427","relation":{},"ISSN":["0018-9391","1558-0040"],"issn-type":[{"value":"0018-9391","type":"print"},{"value":"1558-0040","type":"electronic"}],"subject":[],"published":{"date-parts":[[2024]]}}}