{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,6]],"date-time":"2026-03-06T18:44:33Z","timestamp":1772822673825,"version":"3.50.1"},"reference-count":16,"publisher":"IEEE","license":[{"start":{"date-parts":[[2021,12,7]],"date-time":"2021-12-07T00:00:00Z","timestamp":1638835200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2021,12,7]],"date-time":"2021-12-07T00:00:00Z","timestamp":1638835200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2021,12,7]]},"DOI":"10.1109\/tencon54134.2021.9707274","type":"proceedings-article","created":{"date-parts":[[2022,2,16]],"date-time":"2022-02-16T20:41:43Z","timestamp":1645044103000},"page":"833-838","source":"Crossref","is-referenced-by-count":1,"title":["EMI issues in LVDC-Microgrids due to Power Electronic Converters"],"prefix":"10.1109","author":[{"given":"Angaline","family":"Krishna","sequence":"first","affiliation":[{"name":"Auckland University of Technology(AUT),Department of Electrical & Electronic Engineering,Auckland,New Zealand"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Kosala","family":"Gunawardane","sequence":"additional","affiliation":[{"name":"Auckland University of Technology(AUT),Department of Electrical & Electronic Engineering,Auckland,New Zealand"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2021.3062840"},{"key":"ref11","article-title":"EMerge Alliance- Hybrid AC\/DC & DC Microgrid Standards & Information","year":"0","journal-title":"Emergealliance org"},{"key":"ref12","article-title":"Environmental Engineering (EE); Power supply interface at the input to telecommunications and datacom (ICT) equipment; Part 3: Operated by rectified current source","year":"0","journal-title":"etsi org\/"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/ICOEI.2018.8553695"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/VPPC.2010.5729047"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/19.31008"},{"key":"ref16","article-title":"MATLAB\/Simulink","year":"0","journal-title":"Spectrum Analyzer model"},{"key":"ref4","article-title":"CISPR25 Radiated Emissions","year":"0","journal-title":"Ti com"},{"key":"ref3","article-title":"Buck converters (integrated switch) | Products | TIcom","year":"0","journal-title":"Ti com"},{"key":"ref6","article-title":"Intelligent DC Microgrid Living Lab | Microgrid Projects","year":"0","journal-title":"Microgrids-Project"},{"key":"ref5","article-title":"Automotive EMC Testing: CISPR 25, ISO 11452–2 and Equivalent Standards- In Compliance Magazine","year":"0","journal-title":"Compliance Magazine"},{"key":"ref8","article-title":"How2Power.com- The Engineer's Guide to EMI In DC-DC Converters (Parts 1–5): Standards Requirements and Measurement Techniques","year":"0","journal-title":"How2power com"},{"key":"ref7","article-title":"Analysis and Reduction of Common-Mode and Differential-Mode EMI Noise in a Flyback Switch-Mode Power Supply (SMPS) Converter using Chaos","author":"mohamed","year":"2012","journal-title":"Telecommunications Forum (TELFOR)"},{"key":"ref2","article-title":"AC grid vs DC grid: HV AC transformers vs power electronics and DC\/DC converters - EEP","year":"0","journal-title":"Electrical Engineering Portal"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2017.2705914"},{"key":"ref9","article-title":"Automotive EMC Testing: CISPR 25, ISO 11452–2 and Equivalent Standards- In Compliance Magazine","year":"0","journal-title":"Compliance Magazine"}],"event":{"name":"TENCON 2021 - 2021 IEEE Region 10 Conference (TENCON)","location":"Auckland, New Zealand","start":{"date-parts":[[2021,12,7]]},"end":{"date-parts":[[2021,12,10]]}},"container-title":["TENCON 2021 - 2021 IEEE Region 10 Conference (TENCON)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9707139\/9707180\/09707274.pdf?arnumber=9707274","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,12,7]],"date-time":"2022-12-07T01:59:04Z","timestamp":1670378344000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9707274\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2021,12,7]]},"references-count":16,"URL":"https:\/\/doi.org\/10.1109\/tencon54134.2021.9707274","relation":{},"subject":[],"published":{"date-parts":[[2021,12,7]]}}}