{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,30]],"date-time":"2024-10-30T15:06:19Z","timestamp":1730300779344,"version":"3.28.0"},"reference-count":13,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,10,31]],"date-time":"2023-10-31T00:00:00Z","timestamp":1698710400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,10,31]],"date-time":"2023-10-31T00:00:00Z","timestamp":1698710400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,10,31]]},"DOI":"10.1109\/tencon58879.2023.10322487","type":"proceedings-article","created":{"date-parts":[[2023,11,22]],"date-time":"2023-11-22T19:07:19Z","timestamp":1700680039000},"page":"1293-1298","source":"Crossref","is-referenced-by-count":0,"title":["Evaluation of 3D-DiamondMesh Homogeneous and Heterogeneous Architectures"],"prefix":"10.1109","author":[{"given":"Lakshmi Kiranmai.","family":"V","sequence":"first","affiliation":[{"name":"National Institute of Technology,Department of Electronics and Communication Engineering,Warangal,India"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Kota Naga","family":"Srinivasarao Batta","sequence":"additional","affiliation":[{"name":"National Institute of Technology,Department of Electronics and Communication Engineering,Warangal,India"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Sowjanya","family":"Kotte","sequence":"additional","affiliation":[{"name":"Kakatiya Institute of Technology and Sciences,Department of Electronics and Communication Engineering,Warangal,India"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/2.976921"},{"key":"ref2","article-title":"S. Network-on-Chip: The Next Gen-eration of System-on-Chip","volume-title":"Integration","author":"Kundu","year":"2015"},{"key":"ref3","first-page":"117","article-title":"A Network on Chip Architecture and Design Method-ology","author":"Kumar","year":"2002","journal-title":"Proc. of ISVLSI"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1504\/IJHPSA.2008.021797"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/IWSOC.2003.1213053"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1142\/s0218126623500767"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1016\/j.sysarc.2010.10.009"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.14257\/ijmue.2015.10.10.21"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1016\/j.jpdc.2017.10.011"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1007\/s10617-022-09266-0"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2007.893649"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/MDT.2005.136"},{"key":"ref13","article-title":"Ratatoskr: An open-source framework for in-depth power, performance and area analysis in 3d nocs","volume":"abs\/1912.05670","author":"Joseph","year":"2019","journal-title":"CoRR"}],"event":{"name":"TENCON 2023 - 2023 IEEE Region 10 Conference (TENCON)","start":{"date-parts":[[2023,10,31]]},"location":"Chiang Mai, Thailand","end":{"date-parts":[[2023,11,3]]}},"container-title":["TENCON 2023 - 2023 IEEE Region 10 Conference (TENCON)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10322307\/10322308\/10322487.pdf?arnumber=10322487","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,3,13]],"date-time":"2024-03-13T20:33:30Z","timestamp":1710362010000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10322487\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,10,31]]},"references-count":13,"URL":"https:\/\/doi.org\/10.1109\/tencon58879.2023.10322487","relation":{},"subject":[],"published":{"date-parts":[[2023,10,31]]}}}