{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,21]],"date-time":"2026-05-21T16:54:34Z","timestamp":1779382474780,"version":"3.53.1"},"reference-count":10,"publisher":"IEEE","license":[{"start":{"date-parts":[[2024,12,1]],"date-time":"2024-12-01T00:00:00Z","timestamp":1733011200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,12,1]],"date-time":"2024-12-01T00:00:00Z","timestamp":1733011200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["61974121,61875170"],"award-info":[{"award-number":["61974121,61875170"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,12,1]]},"DOI":"10.1109\/tencon61640.2024.10902775","type":"proceedings-article","created":{"date-parts":[[2025,3,5]],"date-time":"2025-03-05T18:40:14Z","timestamp":1741200014000},"page":"442-445","source":"Crossref","is-referenced-by-count":3,"title":["Research on Integration of Photonic and Electronic Chips Based on Glass Interposer (Invited)"],"prefix":"10.1109","author":[{"given":"Wanyi","family":"Yan","sequence":"first","affiliation":[{"name":"Xiamen University,Department of Microelectronics and Integrated Circuit,Xiamen,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jin","family":"Zhao","sequence":"additional","affiliation":[{"name":"Institute of Electronics Packaging Technology and Reliability, School of Mathematical Statistics and Mechanics Beijing University of Technology,Beijing,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yongjian","family":"Chen","sequence":"additional","affiliation":[{"name":"Xiamen University,Department of Microelectronics and Integrated Circuit,Xiamen,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Zhuliang","family":"Lin","sequence":"additional","affiliation":[{"name":"Xiamen University,Department of Microelectronics and Integrated Circuit,Xiamen,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Dan","family":"Zhang","sequence":"additional","affiliation":[{"name":"Xiamen University,Department of Microelectronics and Integrated Circuit,Xiamen,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Daquan","family":"Yu","sequence":"additional","affiliation":[{"name":"Xiamen University Xiamen Sky Semiconductor,Department of Microelectronics and Integrated Circuit,Xiamen,China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1063\/5.0050117"},{"key":"ref2","first-page":"T3H.1","article-title":"1.6Tbps Silicon Photonics Integrated Circuit for Co-Packaged Optical-IO Switch Applications","volume-title":"Optical Fiber Communication Conference (OFC) 2020","author":"Fathololoumi"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1117\/12.905984"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1016\/j.rinp.2018.06.001"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1016\/j.optlastec.2023.110167"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1088\/1464-4258\/5\/2\/101"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ICSJ47124.2019.8998659"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1063\/1.4938319"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1007\/s10854-007-9239-z"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2016.332"}],"event":{"name":"TENCON 2024 - 2024 IEEE Region 10 Conference (TENCON)","location":"Singapore, Singapore","start":{"date-parts":[[2024,12,1]]},"end":{"date-parts":[[2024,12,4]]}},"container-title":["TENCON 2024 - 2024 IEEE Region 10 Conference (TENCON)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10902665\/10902666\/10902775.pdf?arnumber=10902775","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,3,6]],"date-time":"2025-03-06T06:08:11Z","timestamp":1741241291000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10902775\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,12,1]]},"references-count":10,"URL":"https:\/\/doi.org\/10.1109\/tencon61640.2024.10902775","relation":{},"subject":[],"published":{"date-parts":[[2024,12,1]]}}}