{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,8]],"date-time":"2026-06-08T20:02:40Z","timestamp":1780948960528,"version":"3.54.1"},"reference-count":25,"publisher":"IEEE","license":[{"start":{"date-parts":[[2024,12,1]],"date-time":"2024-12-01T00:00:00Z","timestamp":1733011200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,12,1]],"date-time":"2024-12-01T00:00:00Z","timestamp":1733011200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,12,1]]},"DOI":"10.1109\/tencon61640.2024.10902913","type":"proceedings-article","created":{"date-parts":[[2025,3,5]],"date-time":"2025-03-05T13:40:14Z","timestamp":1741182014000},"page":"790-793","source":"Crossref","is-referenced-by-count":0,"title":["Printed Circuit Board Defect Detection Using YOLOv8s and TensorRT"],"prefix":"10.1109","author":[{"given":"Guillaume Keifer U.","family":"Arenas","sequence":"first","affiliation":[{"name":"Department of Manufacturing Engineering and Management"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Mystro Yushi P.","family":"Fujii","sequence":"additional","affiliation":[{"name":"Department of Manufacturing Engineering and Management"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Anastine Beatrice B.","family":"Josue","sequence":"additional","affiliation":[{"name":"Department of Manufacturing Engineering and Management"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Vincent Andrew Mikael C.","family":"Mataragnon","sequence":"additional","affiliation":[{"name":"Department of Manufacturing Engineering and Management"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jason L.","family":"Espa\u00f1ola","sequence":"additional","affiliation":[{"name":"Department of Manufacturing Engineering and Management"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Kate G.","family":"Francisco","sequence":"additional","affiliation":[{"name":"Department of Manufacturing Engineering and Management"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jose Martin Z.","family":"Maningo","sequence":"additional","affiliation":[{"name":"De La Salle University,Department of Electronics and Computer Engineering,Manila,Philippines"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Argel A.","family":"Bandala","sequence":"additional","affiliation":[{"name":"De La Salle University,Department of Electronics and Computer Engineering,Manila,Philippines"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Ryan Rhay P.","family":"Vicerra","sequence":"additional","affiliation":[{"name":"Department of Manufacturing Engineering and Management"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Elmer P.","family":"Dadios","sequence":"additional","affiliation":[{"name":"Department of Manufacturing Engineering and Management"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.3390\/s23052766"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.3390\/s21154968"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.3390\/app9183750"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijheh.2006.02.001"},{"key":"ref5","article-title":"Inspection and testing methods for PCBs: An overview","author":"Houdek","year":"2016","journal-title":"Engineer\/OwnerCaltronics Design & Assembly"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1016\/j.jmsy.2023.08.019"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.3390\/s21154968"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ISIE.2011.47"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.3390\/pr11030775"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1016\/j.ymssp.2021.108334"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/ISIE.2011.47"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/ASMC51741.2021.9435657"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1016\/j.micpro.2020.103807"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.23919\/ChiCC.2017.8029117"},{"issue":"2","key":"ref15","first-page":"287","volume":"63","author":"Moganti","year":"1996","journal-title":"Automatic PCB inspection algorithms:A survey, Computer Vision and Image Understanding"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.5120\/19985-1938"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/CCAA.2015.7148363"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1016\/0734-189X(88)90108-9"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1049\/joe.2018.8279"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1088\/1742-6596\/1004\/1\/012029"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.30897\/ijegeo.1010741"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.3390\/s23177310"},{"key":"ref25","author":"Huang","year":"2019","journal-title":"A PCB dataset for defects detection and classification"},{"key":"ref26","author":"Dwyer","year":"2022","journal-title":"Roboflow (Version 1.0)"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.54097\/ajst.v7i3.13420"}],"event":{"name":"TENCON 2024 - 2024 IEEE Region 10 Conference (TENCON)","location":"Singapore, Singapore","start":{"date-parts":[[2024,12,1]]},"end":{"date-parts":[[2024,12,4]]}},"container-title":["TENCON 2024 - 2024 IEEE Region 10 Conference (TENCON)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10902665\/10902666\/10902913.pdf?arnumber=10902913","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,6,8]],"date-time":"2026-06-08T19:47:47Z","timestamp":1780948067000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10902913\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,12,1]]},"references-count":25,"URL":"https:\/\/doi.org\/10.1109\/tencon61640.2024.10902913","relation":{},"subject":[],"published":{"date-parts":[[2024,12,1]]}}}