{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,6,27]],"date-time":"2025-06-27T04:13:01Z","timestamp":1750997581442,"version":"3.41.0"},"reference-count":13,"publisher":"IEEE","license":[{"start":{"date-parts":[[2024,12,1]],"date-time":"2024-12-01T00:00:00Z","timestamp":1733011200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,12,1]],"date-time":"2024-12-01T00:00:00Z","timestamp":1733011200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,12,1]]},"DOI":"10.1109\/tencon61640.2024.11049369","type":"proceedings-article","created":{"date-parts":[[2025,6,25]],"date-time":"2025-06-25T18:16:36Z","timestamp":1750875396000},"page":"1962-1965","source":"Crossref","is-referenced-by-count":0,"title":["Physics-Based GaN HEMT Device Modeling for MIMC"],"prefix":"10.1109","author":[{"given":"Amgad A.","family":"Al-Saman","sequence":"first","affiliation":[{"name":"Suzhou National Loborotory,Department of Information Materials,Suzhou,China"}]},{"given":"Hassan A.","family":"Al-Samman","sequence":"additional","affiliation":[{"name":"School of Information Science and Technology, University of Science and Technology of China,Hefei,China"}]},{"given":"Yi","family":"Pei","sequence":"additional","affiliation":[{"name":"Dyanx Semiconductor Inc.,Department of Research and Development,Suzhou,China"}]},{"given":"Fujiang","family":"Lin","sequence":"additional","affiliation":[{"name":"School of Microelectronics, University of Science and Technology of China,Hefei,China"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ted.2017.2657579"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1016\/bs.semsem.2019.08.002"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1007\/978-981-10-3066-6_1"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/22.538957"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1002\/pssc.201300392"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2013.2265320"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1088\/1674-4926\/44\/8\/082802"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1016\/j.sse.2021.108209"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/APEC.2018.8341420"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2013.2275943"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-7091-0560-3"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/ted.2020.3012116"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/icta53157.2021.9661984"}],"event":{"name":"TENCON 2024 - 2024 IEEE Region 10 Conference (TENCON)","start":{"date-parts":[[2024,12,1]]},"location":"Singapore, Singapore","end":{"date-parts":[[2024,12,4]]}},"container-title":["TENCON 2024 - 2024 IEEE Region 10 Conference (TENCON)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10902665\/10902666\/11049369.pdf?arnumber=11049369","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,26]],"date-time":"2025-06-26T17:39:53Z","timestamp":1750959593000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11049369\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,12,1]]},"references-count":13,"URL":"https:\/\/doi.org\/10.1109\/tencon61640.2024.11049369","relation":{},"subject":[],"published":{"date-parts":[[2024,12,1]]}}}