{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,4,1]],"date-time":"2025-04-01T11:03:01Z","timestamp":1743505381210,"version":"3.28.0"},"reference-count":15,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"DOI":"10.1109\/test.2003.1270884","type":"proceedings-article","created":{"date-parts":[[2004,7,8]],"date-time":"2004-07-08T16:05:44Z","timestamp":1089302744000},"page":"574-583","source":"Crossref","is-referenced-by-count":2,"title":["A scalable scan-path test point insertion technique to enhance delay fault coverage for standard scan designs"],"prefix":"10.1109","volume":"1","author":[{"family":"Seongmoon Wang","sequence":"first","affiliation":[]},{"given":"S.T.","family":"Chakradhar","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"15","doi-asserted-by":"publisher","DOI":"10.1109\/MDT.1987.295104"},{"key":"13","first-page":"342","article-title":"Model for Delay Faults Based Upon Paths","author":"smith","year":"1985","journal-title":"Proceedings IEEE International Test Conference"},{"key":"14","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.1996.557122"},{"key":"11","doi-asserted-by":"publisher","DOI":"10.1109\/43.298042"},{"key":"12","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2002.1041869"},{"key":"3","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.1991.519696"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.1991.519700"},{"key":"1","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2002.1041868"},{"key":"10","doi-asserted-by":"publisher","DOI":"10.1109\/43.238615"},{"key":"7","article-title":"Reducing Correlation to Improve Coverage of Delay Faults in Scan-Path Design","volume":"13","author":"mao","year":"1994","journal-title":"IEEE Trans on Computer-Aided Design of Integrated Circuit and System"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1109\/DAC.1980.1585245"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1109\/TC.1981.1675757"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2000.894217"},{"key":"9","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.1991.519737"},{"key":"8","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.1999.805824"}],"event":{"name":"International Test Conference, 2003. ITC 2003.","location":"Washington, DC, USA"},"container-title":["International Test Conference, 2003. Proceedings. ITC 2003."],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/8970\/28457\/01270884.pdf?arnumber=1270884","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,13]],"date-time":"2017-03-13T20:51:06Z","timestamp":1489438266000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/1270884\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[null]]},"references-count":15,"URL":"https:\/\/doi.org\/10.1109\/test.2003.1270884","relation":{},"subject":[]}}