{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,3,30]],"date-time":"2025-03-30T04:44:21Z","timestamp":1743309861873,"version":"3.28.0"},"reference-count":59,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"DOI":"10.1109\/test.2003.1270897","type":"proceedings-article","created":{"date-parts":[[2004,7,8]],"date-time":"2004-07-08T16:05:44Z","timestamp":1089302744000},"page":"681-690","source":"Crossref","is-referenced-by-count":4,"title":["Mems design and verification"],"prefix":"10.1109","volume":"1","author":[{"given":"T.","family":"Mukheljee","sequence":"first","affiliation":[]}],"member":"263","reference":[{"key":"35","doi-asserted-by":"crossref","first-page":"103","DOI":"10.1016\/S0924-4247(97)80100-8","article-title":"Laminated High-Aspect-Ratio Microstructures in a Conventional CMOS Process","volume":"57","author":"fedder","year":"1996","journal-title":"Sensors and Actuators A"},{"journal-title":"DLP Products","year":"0","key":"36"},{"journal-title":"Introduction to iMEMS?","year":"0","key":"33"},{"journal-title":"Intelligent Micro Machine Initiative","year":"0","key":"34"},{"key":"39","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-642-59497-7_66"},{"journal-title":"ASIMPS CMOS-MEMS Alpha-User Short Course","year":"0","key":"37"},{"key":"38","first-page":"426","article-title":"Layout Verification and Correction of CMOS-MEMS Layouts","author":"baidya","year":"2001","journal-title":"Technical Proceedings of the 2001 International Conference on Modeling and Simulation of Microsystems"},{"key":"43","article-title":"Nodal Analysis for MEMS Simulation and Design","author":"clark","year":"1998","journal-title":"1998 Int Conf Modeling and Simulation of Microsystems (MSM 98)"},{"key":"42","doi-asserted-by":"publisher","DOI":"10.1109\/84.767117"},{"key":"41","doi-asserted-by":"publisher","DOI":"10.1109\/84.585788"},{"key":"40","first-page":"11","article-title":"Microfabricated structures for the measurement of mechanical properties and adhesion of thin films","author":"senturia","year":"1987","journal-title":"Proc 4th Int Conf Solid-State Sensors and Actuators (Transducers 87)"},{"journal-title":"IEEE Standard for Inertial Sensor Terminology","year":"0","key":"22"},{"key":"23","doi-asserted-by":"publisher","DOI":"10.1109\/MEMSYS.1998.659750"},{"key":"24","doi-asserted-by":"publisher","DOI":"10.1109\/84.788632"},{"key":"25","article-title":"Hierarchical Representation and Simulation of Micromachined Inertial Sensors","author":"vandemeer","year":"1998","journal-title":"Proc 1998 Int Conf on Modeling and Simulation of Microsystems Semiconductors Sensors and Actuators (MSM '98)"},{"key":"26","article-title":"NODAS 1.3 - Nodal Design Of Actuators And Sensors","author":"fedder","year":"1998","journal-title":"IEEE\/VIUF Int Workshop Behavioral Modeling and Simulation"},{"key":"27","doi-asserted-by":"publisher","DOI":"10.1109\/82.799682"},{"key":"28","doi-asserted-by":"publisher","DOI":"10.1145\/774572.774627"},{"key":"29","doi-asserted-by":"publisher","DOI":"10.1117\/12.462801"},{"key":"3","doi-asserted-by":"publisher","DOI":"10.1109\/MEMSYS.2000.838540"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1109\/5.704274"},{"journal-title":"ADXL202 Accelerometer Data Sheet","year":"1998","key":"1"},{"key":"7","first-page":"93","article-title":"Intelligent Microsystems: Strategy for the Future","author":"smith","year":"1998","journal-title":"Semiconductor International"},{"key":"30","doi-asserted-by":"crossref","first-page":"118","DOI":"10.1016\/S0924-4247(98)00134-4","article-title":"Optimization-based synthesis of microresonators","volume":"70","author":"mukherjee","year":"1998","journal-title":"Sensors and Actuators A"},{"journal-title":"Intelligent Micro Machine Initiative","year":"0","key":"6"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1109\/SENSOR.1995.717093"},{"key":"32","first-page":"42","author":"koester","year":"2003","journal-title":"PolyMUMPs Design Handbook"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1109\/84.993443"},{"key":"31","doi-asserted-by":"publisher","DOI":"10.1109\/SENSOR.2003.1215241"},{"key":"9","doi-asserted-by":"publisher","DOI":"10.1109\/43.898833"},{"key":"8","doi-asserted-by":"publisher","DOI":"10.1109\/DAC.1997.597231"},{"key":"59","first-page":"297","article-title":"Intelligent Automatic Meshing for Multilayer CMOS Micromachined Structures for Finite Element Analysis","author":"lakdawala","year":"1999","journal-title":"Proc 1999 Int Conf Modeling Simulation Microsyst"},{"key":"58","doi-asserted-by":"crossref","first-page":"238","DOI":"10.1117\/12.284521","article-title":"An improved meshing technique and its application in the analysis of large and complex MEMS systems","volume":"3224","author":"he","year":"1997","journal-title":"Proc SPIE Micromachined Devices and Components"},{"key":"57","doi-asserted-by":"publisher","DOI":"10.1109\/MEMSYS.1993.296921"},{"key":"56","article-title":"CFD-Micromesh: An automatic 3D model and mesh builder for microsystem simulations","author":"furmanczyk","year":"2000","journal-title":"Proc of International Conference on Mixed Design of Integrated Circuits and Systems (MIXDES 2008)"},{"journal-title":"Electromechanical Dynamics","year":"1968","author":"woodson","key":"19"},{"key":"55","doi-asserted-by":"publisher","DOI":"10.1145\/774572.774626"},{"key":"17","doi-asserted-by":"publisher","DOI":"10.1016\/S0924-4247(97)01754-8"},{"key":"18","doi-asserted-by":"publisher","DOI":"10.1088\/0960-1317\/6\/1\/036"},{"key":"15","first-page":"11","article-title":"Microfabricated structures for the measurement of mechanical properties and adhesion of thin films","author":"senturia","year":"1987","journal-title":"Proc 4th Int Conf Solid-State Sensors and Actuators (Transducers 87)"},{"key":"16","doi-asserted-by":"publisher","DOI":"10.1109\/5.704266"},{"key":"13","first-page":"40","article-title":"MEMS Systems Design and Verification Tools","author":"maher","year":"1998","journal-title":"Proceedings of SPIE Smart Structures and Materials"},{"key":"14","doi-asserted-by":"publisher","DOI":"10.1109\/54.808207"},{"key":"11","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.1996.542005"},{"key":"12","doi-asserted-by":"publisher","DOI":"10.1109\/DAC.1997.597230"},{"key":"21","doi-asserted-by":"publisher","DOI":"10.1109\/6.694362"},{"key":"20","article-title":"Nodal Simulation of Suspended MEMS with Multiple Degrees of Freedom","author":"vandemeer","year":"1997","journal-title":"Proc 1997 International Mechanical Engineering Congress and Exposition The Winter Annual Meeting of ASME in the 8th Symposium on Microelectromechanical Systems"},{"journal-title":"CaMEL Web Page","article-title":"CaMEL User's Guide","year":"0","key":"49"},{"key":"48","doi-asserted-by":"publisher","DOI":"10.1109\/JMEMS.2002.1007397"},{"journal-title":"VHDL-AMS Language Reference Manual","year":"0","key":"45"},{"journal-title":"Verilog-AMS Language Reference Manual","year":"0","key":"44"},{"key":"47","doi-asserted-by":"publisher","DOI":"10.1109\/MEMSYS.2000.838514"},{"key":"46","doi-asserted-by":"publisher","DOI":"10.1109\/MEMSYS.1997.581759"},{"key":"10","article-title":"Structured Design Methods for MEMS","author":"antonsson","year":"1995","journal-title":"NSF Sponsored Workshop Structured Design Methods for MEMS"},{"key":"51","doi-asserted-by":"publisher","DOI":"10.1109\/MEMSYS.1999.746848"},{"key":"52","article-title":"Layout Synthesis of CMOS-MEMS Accelerometers","author":"gupta","year":"2000","journal-title":"2000 Int Conf Modeling and Simulation of Microsystems (MSM 2000)"},{"key":"53","article-title":"Feature-recognition for MEMS Extraction","author":"baidya","year":"1998","journal-title":"CDROM Proc of 1998 ASME DETC Design Automation Conferences"},{"key":"54","first-page":"143","article-title":"MEMS Component Extraction","author":"baidya","year":"1999","journal-title":"Proc 1999 Int Conf Modeling Simulation Microsyst"},{"journal-title":"Catapult Web Page","year":"0","key":"50"}],"event":{"name":"International Test Conference, 2003. ITC 2003.","location":"Washington, DC, USA"},"container-title":["International Test Conference, 2003. Proceedings. ITC 2003."],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/8970\/28457\/01270897.pdf?arnumber=1270897","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,16]],"date-time":"2017-06-16T04:40:34Z","timestamp":1497588034000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/1270897\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[null]]},"references-count":59,"URL":"https:\/\/doi.org\/10.1109\/test.2003.1270897","relation":{},"subject":[]}}