{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,7]],"date-time":"2024-09-07T01:35:57Z","timestamp":1725672957614},"reference-count":24,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"DOI":"10.1109\/test.2004.1386951","type":"proceedings-article","created":{"date-parts":[[2005,3,21]],"date-time":"2005-03-21T15:07:39Z","timestamp":1111417659000},"page":"181-189","source":"Crossref","is-referenced-by-count":11,"title":["ATE data collection - a comprehensive requirements proposal to maximize ROI of test"],"prefix":"10.1109","author":[{"given":"M.","family":"Rehani","sequence":"first","affiliation":[]},{"given":"D.","family":"Abercrombie","sequence":"additional","affiliation":[]},{"given":"R.","family":"Madge","sequence":"additional","affiliation":[]},{"given":"J.","family":"Teisher","sequence":"additional","affiliation":[]},{"given":"J.","family":"Saw","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref10","first-page":"1154","article-title":"e-Diagnostics - Can ATE vendors step up to the challenge?","author":"madge","year":"2001","journal-title":"Proceedings IEEE International Test Conference"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2003.1271071"},{"key":"ref12","first-page":"1181","article-title":"ATPG versus Logic BIST - Now and in the Future","author":"butler","year":"2001","journal-title":"Proceedings IEEE International Test Conference"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2002.1041769"},{"key":"ref14","article-title":"A Process and Technology-Tolerant IDDQ Method for IC Diagnosis","author":"patel","year":"2001","journal-title":"VTS"},{"key":"ref15","first-page":"17","article-title":"Pre-Empting Yield Problems","author":"derbyshire","year":"2003","journal-title":"Semiconductor Manufacturing"},{"key":"ref16","article-title":"Statistical Post-Processing at Wafersort - An alternative to bum-in and a manufacturable solution to test limit setting for submicron technologies","author":"madge","year":"2002","journal-title":"VTS"},{"journal-title":"Semiconductor Test Consortium STC","article-title":"Openstar update","year":"2004","key":"ref17"},{"year":"2003","key":"ref18","article-title":"International Technology Roadmap for Semiconductors, Test and Test Equipment"},{"key":"ref19","article-title":"Code Fast, Run Fast with XML Data Binding","author":"armstrong","year":"0","journal-title":"Sun Microsystems white paper"},{"key":"ref4","first-page":"27","article-title":"Testing the Tester","author":"rajsuman","year":"2002","journal-title":"Proceedings Special Panel IEEE International Test Conference"},{"key":"ref3","first-page":"30","article-title":"Testing the Tester","author":"rajsuman","year":"2002","journal-title":"Proceedings IEEE International Test Conference"},{"key":"ref6","first-page":"518","article-title":"The Value of Tester Accuracy","author":"dalal","year":"1999","journal-title":"Proceedings IEEE International Test Conference"},{"key":"ref5","first-page":"29","article-title":"Testing the Tester: Specification and Validation Approaches","author":"johnson","year":"2002","journal-title":"Proceedings IEEE International Test Conference"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2002.1041760"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2003.1270853"},{"key":"ref2","first-page":"28","article-title":"Testing the Tester: What Broke? Where? When? Why?","author":"crouch","year":"2002","journal-title":"Proceedings IEEE International Test Conference"},{"key":"ref1","article-title":"Automation Guidelines and Standards for Probe and Test","author":"nageswaran","year":"2002","journal-title":"SEMI"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2000.894285"},{"key":"ref20","article-title":"Intel's ‘casual learning algorithm’ to reduce IC test costs","author":"lapedus","year":"2004","journal-title":"EETimes"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2001.966626"},{"key":"ref21","article-title":"First Time Right’ Design-to-Test Flow","author":"mast","year":"0","journal-title":"White Paper Agilent Technologies"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2001.966693"},{"key":"ref23","article-title":"Geotest Supplier Presentation, Automatic Test Equipment(ATE) Standardization and Commercialization","author":"gutterman","year":"2000","journal-title":"Autotestcon"}],"event":{"name":"International Test Conference 2004","acronym":"TEST-04","location":"Charlotte, NC, USA"},"container-title":["2004 International Conferce on Test"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/9526\/30190\/01386951.pdf?arnumber=1386951","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,14]],"date-time":"2017-03-14T20:01:05Z","timestamp":1489521665000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/1386951\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[null]]},"references-count":24,"URL":"https:\/\/doi.org\/10.1109\/test.2004.1386951","relation":{},"subject":[]}}