{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,22]],"date-time":"2024-10-22T18:47:28Z","timestamp":1729622848048,"version":"3.28.0"},"reference-count":24,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"DOI":"10.1109\/test.2004.1387338","type":"proceedings-article","created":{"date-parts":[[2005,3,21]],"date-time":"2005-03-21T20:07:39Z","timestamp":1111435659000},"page":"758-763","source":"Crossref","is-referenced-by-count":0,"title":["Test strategies for a 40 Gbps framer SoC"],"prefix":"10.1109","author":[{"given":"H.T.","family":"Heineken","sequence":"first","affiliation":[]},{"given":"J.B.","family":"Khare","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"doi-asserted-by":"publisher","key":"ref10","DOI":"10.1109\/VTEST.1997.600334"},{"doi-asserted-by":"publisher","key":"ref11","DOI":"10.1109\/TEST.1997.639727"},{"key":"ref12","doi-asserted-by":"crossref","first-page":"112","DOI":"10.1109\/VTEST.1996.510844","article-title":"Current signatures","author":"gattiker","year":"1996","journal-title":"IEEE VLSI Test Symposium"},{"doi-asserted-by":"publisher","key":"ref13","DOI":"10.1109\/TEST.1997.639608"},{"year":"1992","journal-title":"The International Telegraph and Telephone Consultative Committee Recommendation 0 151","article-title":"Error Performance Measuring Equipment Operating at the Primary Rate and Above","key":"ref14"},{"key":"ref15","first-page":"19","article-title":"The impact of burn-in on IC reliability","volume":"29","author":"denton","year":"1986","journal-title":"J Envimnmental Sci"},{"doi-asserted-by":"publisher","key":"ref16","DOI":"10.1080\/07408179008964170"},{"doi-asserted-by":"publisher","key":"ref17","DOI":"10.1109\/RELPHY.1996.492055"},{"key":"ref18","article-title":"A defect model of reliability","author":"glenn shirley","year":"1996","journal-title":"Tutorial Notes international Reliability Physicis Meeting"},{"key":"ref19","article-title":"An overview of manufacturing yield and reliability modeling for semiconductor products","volume":"87","author":"kuo","year":"1999","journal-title":"Proceedings of the IEEE"},{"doi-asserted-by":"publisher","key":"ref4","DOI":"10.1109\/VTEST.1993.313370"},{"doi-asserted-by":"publisher","key":"ref3","DOI":"10.1109\/TC.1981.1675742"},{"year":"2001","journal-title":"Implementation Agreement OIF-SP14–02 0","article-title":"System Packet Interface Level 4 (SPI-4) Phase 2: OC-192 System Interface for Physical and Link Layer Devices","key":"ref6"},{"doi-asserted-by":"publisher","key":"ref5","DOI":"10.1109\/ETC.1993.246604"},{"doi-asserted-by":"publisher","key":"ref8","DOI":"10.1109\/54.46891"},{"year":"2001","journal-title":"OIF Document oif2001 145 1","article-title":"Serdes Framer Interface Level 5 (SFI-5): Implementation Agreement for 40Gbps Interface for Physical Layer Devices","key":"ref7"},{"doi-asserted-by":"publisher","key":"ref2","DOI":"10.1109\/JSSC.1982.1051686"},{"key":"ref1","doi-asserted-by":"crossref","first-page":"135","DOI":"10.1145\/196244.196311","article-title":"cost of silicon viewed from vlsi design perspective","author":"maly","year":"1994","journal-title":"31st Design Automation Conference"},{"doi-asserted-by":"publisher","key":"ref9","DOI":"10.1007\/BF00135340"},{"doi-asserted-by":"publisher","key":"ref20","DOI":"10.1049\/el:19830156"},{"doi-asserted-by":"publisher","key":"ref22","DOI":"10.1109\/ICCAD.1996.569823"},{"key":"ref21","first-page":"874","article-title":"Modeling of integrated circuit defect sensitivities","volume":"sc 20","author":"stapper","year":"1985","journal-title":"IEEE J Solid-State Circuits"},{"key":"ref24","article-title":"Maximizing wafer productivity through layout optimizations","author":"ouyang","year":"2000","journal-title":"Proc VLSI'00"},{"doi-asserted-by":"publisher","key":"ref23","DOI":"10.1109\/CICC.2000.852629"}],"event":{"acronym":"TEST-04","name":"International Test Conference 2004","location":"Charlotte, NC, USA"},"container-title":["2004 International Conferce on Test"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/9526\/30190\/01387338.pdf?arnumber=1387338","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2019,2,4]],"date-time":"2019-02-04T22:02:28Z","timestamp":1549317748000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/1387338\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[null]]},"references-count":24,"URL":"https:\/\/doi.org\/10.1109\/test.2004.1387338","relation":{},"subject":[]}}