{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,3,19]],"date-time":"2025-03-19T10:52:20Z","timestamp":1742381540227,"version":"3.28.0"},"reference-count":9,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"DOI":"10.1109\/test.2005.1584092","type":"proceedings-article","created":{"date-parts":[[2006,2,6]],"date-time":"2006-02-06T10:51:40Z","timestamp":1139223100000},"page":"1236-1244","source":"Crossref","is-referenced-by-count":6,"title":["Impact of back side circuit edit on active device performance in bulk silicon ICs"],"prefix":"10.1109","author":[{"given":"C.","family":"Boit","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"U.","family":"Kerst","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"R.","family":"Schlangen","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"A.","family":"Kabakow","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"E.","family":"Le Roya","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"T.R.","family":"Lundquista","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"S.","family":"Pauthner","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"3","volume":"792","author":"le roy","year":"2004","journal-title":"Mat Res Soc Symp Proc"},{"key":"2","first-page":"409","article-title":"Coaxial, Photon-Ion Technology Enables Direct Navigation to Buried Nodes on Planarized Surfaces, including Silicon","author":"thompson","year":"2002","journal-title":"Proc 28th ISTFA"},{"year":"0","key":"1"},{"key":"7","article-title":"Effects of FIB Radiation on MOS Transistors","author":"campbell","year":"1997","journal-title":"Proc IRPS"},{"journal-title":"Fundamentals of Modern VLSI Devices","year":"1999","author":"taur","key":"6"},{"key":"5","article-title":"Reliability of Ultra Thinning of Flip Chips for Through Silicon Analysis","author":"tsao","year":"2002","journal-title":"Proc IRPS"},{"key":"4","first-page":"157","article-title":"Contacting Silicon with FIB for Back side Circuit Edit","author":"boit","year":"2004","journal-title":"Proc 21st ISTFA"},{"key":"9","first-page":"331","article-title":"Voltage Contrast like Imaging of N-wells","author":"boit","year":"2003","journal-title":"Proc 29th ISTFA"},{"key":"8","first-page":"215","article-title":"Study on a Single NFET Degredation After Circuit Modification with FIB","author":"lehner","year":"2002","journal-title":"Proc 28th ISTFA"}],"event":{"name":"IEEE International Conference on Test, 2005.","location":"Charlotte, NC, USA"},"container-title":["IEEE International Conference on Test, 2005."],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/10560\/33431\/01584092.pdf?arnumber=1584092","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,14]],"date-time":"2017-03-14T23:59:20Z","timestamp":1489535960000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/1584092\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[null]]},"references-count":9,"URL":"https:\/\/doi.org\/10.1109\/test.2005.1584092","relation":{},"subject":[]}}