{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,12]],"date-time":"2026-06-12T21:04:21Z","timestamp":1781298261358,"version":"3.54.1"},"reference-count":26,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2007]]},"DOI":"10.1109\/test.2007.4437573","type":"proceedings-article","created":{"date-parts":[[2008,1,29]],"date-time":"2008-01-29T15:41:30Z","timestamp":1201621290000},"page":"1-10","source":"Crossref","is-referenced-by-count":3,"title":["A heuristic for thermal-safe SoC test scheduling"],"prefix":"10.1109","author":[{"family":"Zhiyuan He","sequence":"first","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"family":"Zebo Peng","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"family":"Petru Eles","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"19","doi-asserted-by":"publisher","DOI":"10.1137\/0209064"},{"key":"17","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2006.873898"},{"key":"18","doi-asserted-by":"publisher","DOI":"10.1109\/DFT.2006.65"},{"key":"15","first-page":"291","article-title":"power constrained and defectprobability driven soc test scheduling with test set partitioning","author":"he","year":"2006","journal-title":"Proc Design Automation and Test in Europe (DATE) Conf"},{"key":"16","first-page":"552","article-title":"thermal-aware test scheduling and hot spot temperature minimization for core-based systems","author":"liu","year":"2005","journal-title":"IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems (DFT)"},{"key":"13","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.1998.743167"},{"key":"14","doi-asserted-by":"publisher","DOI":"10.1109\/92.585217"},{"key":"11","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.1998.743185"},{"key":"12","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2003.1252857"},{"key":"21","doi-asserted-by":"publisher","DOI":"10.1016\/j.ipl.2004.01.006"},{"key":"20","doi-asserted-by":"publisher","DOI":"10.1016\/0377-2217(90)90350-K"},{"key":"22","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2006.876103"},{"key":"23","doi-asserted-by":"crossref","first-page":"2","DOI":"10.1145\/871656.859620","article-title":"temperature-aware microarchitecture","author":"skadron","year":"2003","journal-title":"Int Symp Comput Architect"},{"key":"24","first-page":"878","article-title":"Compact thermal modeling for temperature-aware design","author":"wei huang","year":"2004","journal-title":"Proceedings 41st Design Automation Conference 2004 DAC"},{"key":"25","doi-asserted-by":"publisher","DOI":"10.1109\/ETW.2003.1231669"},{"key":"26","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2006.297693"},{"key":"3","year":"0"},{"key":"2","article-title":"managing the impact of increasing microprocessor power consumption","author":"gunther","year":"2001","journal-title":"Intel Technology Journal"},{"key":"10","doi-asserted-by":"publisher","DOI":"10.1023\/A:1016589322936"},{"key":"1","doi-asserted-by":"publisher","DOI":"10.1109\/40.782564"},{"key":"7","doi-asserted-by":"publisher","DOI":"10.1109\/2.544235"},{"key":"6","article-title":"how power-aware test improves reliability and yield","author":"shi","year":"0","journal-title":"EE Times"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2000.894298"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1145\/980152.980157"},{"key":"9","doi-asserted-by":"publisher","DOI":"10.1109\/ATS.2001.990293"},{"key":"8","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.1998.743146"}],"event":{"name":"2007 IEEE International Test Conference","location":"Santa Clara, CA, USA","start":{"date-parts":[[2007,10,21]]},"end":{"date-parts":[[2007,10,26]]}},"container-title":["2007 IEEE International Test Conference"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/4437545\/4437546\/04437573.pdf?arnumber=4437573","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,6,12]],"date-time":"2026-06-12T20:53:53Z","timestamp":1781297633000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/4437573\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2007]]},"references-count":26,"URL":"https:\/\/doi.org\/10.1109\/test.2007.4437573","relation":{},"subject":[],"published":{"date-parts":[[2007]]}}}