{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,12]],"date-time":"2026-06-12T21:04:46Z","timestamp":1781298286863,"version":"3.54.1"},"reference-count":17,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2007]]},"DOI":"10.1109\/test.2007.4437595","type":"proceedings-article","created":{"date-parts":[[2008,1,29]],"date-time":"2008-01-29T15:41:30Z","timestamp":1201621290000},"page":"1-10","source":"Crossref","is-referenced-by-count":17,"title":["High throughput non-contact SiP testing"],"prefix":"10.1109","author":[{"given":"B.","family":"Moore","sequence":"first","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"C.","family":"Sellathamby","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"P.","family":"Cauvet","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"H.","family":"Fleury","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"M.","family":"Paulson","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"M.","family":"Reja","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"L.","family":"Fu","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"B.","family":"Bai","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"E.","family":"Reid","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"I.","family":"Filanovsky","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"S.","family":"Slupsky","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"17","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2006.297619"},{"key":"15","article-title":"essentials of electronic testing for digital, memory and mixed-signal vlsi circuits","author":"bushnell","year":"2000","journal-title":"Kluwer Academic Publisher"},{"key":"16","doi-asserted-by":"publisher","DOI":"10.1109\/SOCC.2004.1362363"},{"key":"13","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2004.1387354"},{"key":"14","doi-asserted-by":"publisher","DOI":"10.1109\/TIM.2003.818725"},{"key":"11","article-title":"inductive-coupling inter-chip link for system in a package","author":"kuroda","year":"2006","journal-title":"CMOS-Emerging Technologies Workshop"},{"key":"12","doi-asserted-by":"publisher","DOI":"10.1557\/mrs2002.247"},{"key":"3","article-title":"design of a wireless on-wafer sub-micron characterization system","volume":"2","author":"moore","year":"2005","journal-title":"IEEE TVLSI Journal"},{"key":"2","year":"0"},{"key":"1","year":"0"},{"key":"10","year":"0"},{"key":"7","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2005.1583957"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2006.297633"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2005.1584004"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2004.1387391"},{"key":"9","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2002.1041794"},{"key":"8","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2006.297745"}],"event":{"name":"2007 IEEE International Test Conference","location":"Santa Clara, CA, USA","start":{"date-parts":[[2007,10,21]]},"end":{"date-parts":[[2007,10,26]]}},"container-title":["2007 IEEE International Test Conference"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/4437545\/4437546\/04437595.pdf?arnumber=4437595","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,6,12]],"date-time":"2026-06-12T20:53:52Z","timestamp":1781297632000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/4437595\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2007]]},"references-count":17,"URL":"https:\/\/doi.org\/10.1109\/test.2007.4437595","relation":{},"subject":[],"published":{"date-parts":[[2007]]}}}