{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,12]],"date-time":"2026-06-12T21:04:46Z","timestamp":1781298286808,"version":"3.54.1"},"reference-count":4,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2007]]},"DOI":"10.1109\/test.2007.4437601","type":"proceedings-article","created":{"date-parts":[[2008,1,29]],"date-time":"2008-01-29T15:41:30Z","timestamp":1201621290000},"page":"1-10","source":"Crossref","is-referenced-by-count":1,"title":["Impact of Quad Flat No Lead package (QFN) on automated X-ray inspection (AXI)"],"prefix":"10.1109","author":[{"family":"Chwee Liong","sequence":"first","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"family":"Tee","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Andy","family":"Pascual","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"3","article-title":"round robin testing and analysis of lead free solder pastes with alloys of tin, silver and copper","year":"2005","journal-title":"IPC Solder Products Value Council Final Report"},{"key":"2","year":"0"},{"key":"1","author":"james","year":"0","journal-title":"Big Growth for Tiny Packages"},{"key":"4","author":"ahmer","year":"0","journal-title":"Board Level Assembly and Reliability Considerations for QFN Type Packages"}],"event":{"name":"2007 IEEE International Test Conference","location":"Santa Clara, CA, USA","start":{"date-parts":[[2007,10,21]]},"end":{"date-parts":[[2007,10,26]]}},"container-title":["2007 IEEE International Test Conference"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/4437545\/4437546\/04437601.pdf?arnumber=4437601","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,6,12]],"date-time":"2026-06-12T20:53:53Z","timestamp":1781297633000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/4437601\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2007]]},"references-count":4,"URL":"https:\/\/doi.org\/10.1109\/test.2007.4437601","relation":{},"subject":[],"published":{"date-parts":[[2007]]}}}