{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,30]],"date-time":"2024-10-30T15:12:48Z","timestamp":1730301168606,"version":"3.28.0"},"reference-count":17,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2008,10]]},"DOI":"10.1109\/test.2008.4700561","type":"proceedings-article","created":{"date-parts":[[2008,12,10]],"date-time":"2008-12-10T12:55:58Z","timestamp":1228913758000},"page":"1-8","source":"Crossref","is-referenced-by-count":5,"title":["Failing Frequency Signature Analysis"],"prefix":"10.1109","author":[{"given":"Jaekwang","family":"Lee","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Edward J.","family":"McCluskey","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"17","first-page":"242","article-title":"evaluating the effectiveness of detecting delay defects in the slack interval: a simulation study","author":"yan","year":"0","journal-title":"Proc Intl Test Conf"},{"key":"15","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2004.835137"},{"key":"16","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2003.1270830"},{"key":"13","article-title":"silicon evaluation of longest path avoidance testing for small-delay defects","volume":"22","author":"turakhia","year":"2007","journal-title":"Proc Intl Test Conf"},{"key":"14","doi-asserted-by":"publisher","DOI":"10.1109\/MDT.1987.295104"},{"key":"11","doi-asserted-by":"publisher","DOI":"10.1109\/VTEST.1994.292299"},{"key":"12","first-page":"342","article-title":"model for delay faults based upon paths","author":"smith","year":"1985","journal-title":"Proc Intl Test Conf"},{"key":"3","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2004.1387378"},{"key":"2","article-title":"understanding ntf ccomponents ffrom the field","author":"davidson","year":"2005","journal-title":"Proc Intl Test Conf"},{"key":"1","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2005.1583992"},{"key":"10","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2004.1386956"},{"key":"7","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2000.894237"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1109\/VTEST.2004.1299224"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2004.1386955"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1109\/VTS.2008.45"},{"key":"9","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2003.1270886"},{"key":"8","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2004.1386966"}],"event":{"name":"2008 IEEE International Test Conference","start":{"date-parts":[[2008,10,28]]},"location":"Santa Clara, CA","end":{"date-parts":[[2008,10,30]]}},"container-title":["2008 IEEE International Test Conference"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/4690905\/4700527\/04700561.pdf?arnumber=4700561","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2019,1,22]],"date-time":"2019-01-22T00:14:58Z","timestamp":1548116098000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/4700561\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2008,10]]},"references-count":17,"URL":"https:\/\/doi.org\/10.1109\/test.2008.4700561","relation":{},"subject":[],"published":{"date-parts":[[2008,10]]}}}