{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,5,21]],"date-time":"2025-05-21T06:11:50Z","timestamp":1747807910466},"reference-count":26,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2008,10]]},"DOI":"10.1109\/test.2008.4700651","type":"proceedings-article","created":{"date-parts":[[2008,12,10]],"date-time":"2008-12-10T12:55:58Z","timestamp":1228913758000},"page":"1-10","source":"Crossref","is-referenced-by-count":7,"title":["Beyond 10 Gbps? Challenges of Characterizing Future I\/O Interfaces with Automated Test Equipment"],"prefix":"10.1109","author":[{"given":"J.","family":"Moreira","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"H.","family":"Barnes","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"H.","family":"Kaga","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"M.","family":"Comai","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"B.","family":"Roth","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"M.","family":"Culver","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"19","article-title":"comparison of signaling and equalization schemes in high speed serdes (10-25gbps)","author":"liu","year":"2007","journal-title":"Proceedings of the IEC DesignCon"},{"key":"17","doi-asserted-by":"publisher","DOI":"10.1109\/MSMW.2007.4294821"},{"key":"18","article-title":"ate interconnect performance to 43gbps using advanced pcb materials","author":"barnes","year":"2008","journal-title":"Proceedings ofthe IEC DesignCon"},{"key":"15","doi-asserted-by":"publisher","DOI":"10.1109\/APMC.2006.4429444"},{"journal-title":"Signal Integrity Simplified","year":"2003","author":"bogatin","key":"16"},{"key":"13","article-title":"performance at the dut: techniques for evaluating the performance of an ate system at the device under test socket","author":"barnes","year":"2008","journal-title":"Proceedings of the IEC DesignCon"},{"key":"14","article-title":"addressing the challenges an at-speed production test cell for 1ogb\/s wafer probing","author":"moreira","year":"2005","journal-title":"Proceedings of the IEC DesignCon"},{"key":"11","article-title":"a self-testing bost for high-frequency plls, dlls, and serdes","author":"hunter","year":"2007","journal-title":"IEEE International Test Conference"},{"key":"12","article-title":"applications of soft defect localization (sdl) on amd advanced soi microprocessors","author":"seah","year":"2006","journal-title":"International Symposium for Test & Failure Analysis"},{"key":"21","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2002.1041792"},{"key":"20","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIC.2004.1346533"},{"key":"22","article-title":"passive equalization of test fixtures for high-speed digital measurements with automated test equipment","author":"moreira","year":"2006","journal-title":"IEEE Design and Test Workshop"},{"key":"23","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2007.907215"},{"key":"24","doi-asserted-by":"publisher","DOI":"10.1109\/ICVD.2004.1261033"},{"key":"25","article-title":"liquid cooling high power compact electronics","author":"pfahnl","year":"2004","journal-title":"Proc Int Soc Conf Thermal Phenomena"},{"key":"26","article-title":"design and test for multiple gbps communication devices and systems","author":"li","year":"2005","journal-title":"IEC"},{"key":"3","doi-asserted-by":"crossref","DOI":"10.1007\/978-3-540-28912-8","author":"pavesi","year":"2006","journal-title":"Optical Interconnects The Silicon Approach"},{"key":"2","first-page":"4252","article-title":"limit to the bit- rate capacity of electrical interconnects from the aspect ratio of the system architecture","author":"miller","year":"1997","journal-title":"Journal ofDistributed Computing 41"},{"key":"10","article-title":"parametric testing of a 10gb\/s i\/o cell in production through a parametric loopback approach with retiming","author":"moreira","year":"2006","journal-title":"IEEE Design and Test Workshop"},{"key":"1","doi-asserted-by":"publisher","DOI":"10.1109\/MSPEC.2002.1021941"},{"key":"7","article-title":"multi-level signaling in highdensity, high-speed electrical links","author":"kam","year":"2008","journal-title":"Proceedings of the IECDesignCon"},{"journal-title":"A Comparison of NRZ and PAM-4 for I1 Gbps+ Data","year":"2006","author":"deas","key":"6"},{"key":"5","doi-asserted-by":"crossref","DOI":"10.1109\/TEST.2002.1041845","article-title":"new paradigm for signal paths in ate pin electronics are needed for serial com device testing","author":"shimanouchi","year":"2002","journal-title":"IEEE International Test Conference"},{"key":"4","article-title":"pcb loadboard design challenges for multi-gigabit devices in automated test applications","author":"moreira","year":"2006","journal-title":"Proceedings ofthe IEC DesignCon"},{"journal-title":"High-Speed Digital Design A Handbook of Black Magic","year":"1993","author":"johnson","key":"9"},{"key":"8","doi-asserted-by":"publisher","DOI":"10.1109\/4.881207"}],"event":{"name":"2008 IEEE International Test Conference","start":{"date-parts":[[2008,10,28]]},"location":"Santa Clara, CA","end":{"date-parts":[[2008,10,30]]}},"container-title":["2008 IEEE International Test Conference"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/4690905\/4700527\/04700651.pdf?arnumber=4700651","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,18]],"date-time":"2017-06-18T10:37:28Z","timestamp":1497782248000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/4700651\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2008,10]]},"references-count":26,"URL":"https:\/\/doi.org\/10.1109\/test.2008.4700651","relation":{},"subject":[],"published":{"date-parts":[[2008,10]]}}}