{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,20]],"date-time":"2024-09-20T16:01:03Z","timestamp":1726848063828},"reference-count":34,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2011,9]]},"DOI":"10.1109\/test.2011.6139179","type":"proceedings-article","created":{"date-parts":[[2012,1,31]],"date-time":"2012-01-31T16:37:40Z","timestamp":1328027860000},"page":"1-10","source":"Crossref","is-referenced-by-count":87,"title":["Pre-bond probing of TSVs in 3D stacked ICs"],"prefix":"10.1109","author":[{"given":"Brandon","family":"Noia","sequence":"first","affiliation":[]},{"given":"Krishnendu","family":"Chakrabarty","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"doi-asserted-by":"publisher","key":"ref33","DOI":"10.1109\/22.3659"},{"year":"0","journal-title":"45nm PTM LP Model","key":"ref32"},{"doi-asserted-by":"publisher","key":"ref31","DOI":"10.1109\/MEMSYS.2002.984278"},{"key":"ref30","article-title":"Probe Needle Wear and Contact Resistance","author":"broz","year":"0","journal-title":"Proc IEEE SouthWest Test WorkShop"},{"year":"0","author":"weeden","article-title":"Probe Card Tutorial","key":"ref34"},{"key":"ref10","first-page":"1","article-title":"10 m Fine Pitch Cu\/Sn Micro-bumps for 3-D Super-chip Stack","author":"ohara","year":"2009","journal-title":"Proc 3D System Integration"},{"doi-asserted-by":"publisher","key":"ref11","DOI":"10.1109\/VTS.2010.5469556"},{"doi-asserted-by":"publisher","key":"ref12","DOI":"10.1109\/ETSYM.2010.5512787"},{"doi-asserted-by":"publisher","key":"ref13","DOI":"10.1109\/TEST.2010.5699219"},{"doi-asserted-by":"publisher","key":"ref14","DOI":"10.1145\/1687399.1687434"},{"doi-asserted-by":"publisher","key":"ref15","DOI":"10.1109\/ICCD.2008.4751864"},{"doi-asserted-by":"publisher","key":"ref16","DOI":"10.1109\/DATE.2009.5090661"},{"key":"ref17","article-title":"Comparing Throug-Silicon-Via (TSV) Void\/Pinhole Defect Self-Test Methods","author":"lou","year":"2010","journal-title":"Informal Proc International 3D-Test Workshop"},{"doi-asserted-by":"publisher","key":"ref18","DOI":"10.1109\/54.20385"},{"doi-asserted-by":"publisher","key":"ref19","DOI":"10.1109\/IEDM.1995.499317"},{"year":"2010","author":"olsen","journal-title":"AMD Private Correspondence","key":"ref28"},{"doi-asserted-by":"publisher","key":"ref4","DOI":"10.1109\/MDT.2009.125"},{"year":"0","journal-title":"QT2256–320 PXI","key":"ref27"},{"doi-asserted-by":"publisher","key":"ref3","DOI":"10.1109\/ICCD.2004.1347939"},{"key":"ref6","article-title":"Elec-trical Tests for Three-dimensional ICs (3DICs) with TSVs","author":"chen","year":"2010","journal-title":"Informal Proc International Test Conference 3D-Test Workshop"},{"doi-asserted-by":"publisher","key":"ref29","DOI":"10.1109\/3DIC.2009.5306594"},{"doi-asserted-by":"publisher","key":"ref5","DOI":"10.1109\/TEST.2009.5355573"},{"doi-asserted-by":"publisher","key":"ref8","DOI":"10.1109\/ICCAD.2010.5654255"},{"doi-asserted-by":"publisher","key":"ref7","DOI":"10.1109\/TEST.2007.4437621"},{"doi-asserted-by":"publisher","key":"ref2","DOI":"10.1109\/MDT.2005.134"},{"doi-asserted-by":"publisher","key":"ref9","DOI":"10.1109\/VTS.2010.5469559"},{"key":"ref1","first-page":"130","article-title":"8Gb 3D DDR3 DRAM Using Through-Silicon-Via Technology","author":"kang","year":"2009","journal-title":"Proc International Solid State Circuits Conference"},{"doi-asserted-by":"publisher","key":"ref20","DOI":"10.1109\/84.749401"},{"doi-asserted-by":"publisher","key":"ref22","DOI":"10.1109\/EPTC.2010.5702622"},{"doi-asserted-by":"publisher","key":"ref21","DOI":"10.1109\/84.623113"},{"doi-asserted-by":"publisher","key":"ref24","DOI":"10.1109\/HPCA.2007.346197"},{"key":"ref23","article-title":"KGD Probing of TSVs at 40 µm Array Pitch","author":"smith","year":"2010","journal-title":"Informal Proc International 3D-Test Workshop"},{"key":"ref26","first-page":"475","article-title":"Automatic Balancing of Linear AC Bridge Circuits for Capacitive Sensor Elements","author":"holmberg","year":"2010","journal-title":"Instrumentation and Measurement Technology Conference"},{"key":"ref25","article-title":"Trends in Test","author":"lee","year":"0","journal-title":"IEEE Asian Test Symposium"}],"event":{"name":"2011 IEEE International Test Conference (ITC)","start":{"date-parts":[[2011,9,20]]},"location":"Anaheim, CA, USA","end":{"date-parts":[[2011,9,22]]}},"container-title":["2011 IEEE International Test Conference"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/6132473\/6139126\/06139179.pdf?arnumber=6139179","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,21]],"date-time":"2017-03-21T15:18:10Z","timestamp":1490109490000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6139179\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2011,9]]},"references-count":34,"URL":"https:\/\/doi.org\/10.1109\/test.2011.6139179","relation":{},"subject":[],"published":{"date-parts":[[2011,9]]}}}