{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,7]],"date-time":"2024-09-07T22:52:39Z","timestamp":1725749559281},"reference-count":15,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2013,9]]},"DOI":"10.1109\/test.2013.6651906","type":"proceedings-article","created":{"date-parts":[[2013,11,11]],"date-time":"2013-11-11T14:57:38Z","timestamp":1384181858000},"page":"1-8","source":"Crossref","is-referenced-by-count":16,"title":["Delay testing and characterization of post-bond interposer wires in 2.5-D ICs"],"prefix":"10.1109","author":[{"given":"Shi-Yu","family":"Huang","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Li-Ren","family":"Huang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Kun-Han","family":"Tsai","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Wu-Tung","family":"Cheng","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"journal-title":"Chip Implementation Center CIC Taiwan Document No CIC-DSD-RD-08-01","article-title":"CIC reference flow for cell-based ic design","year":"2008","key":"15"},{"key":"13","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2008.4700548"},{"key":"14","doi-asserted-by":"publisher","DOI":"10.1145\/2228360.2228545"},{"key":"11","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.1989.77002"},{"key":"12","doi-asserted-by":"publisher","DOI":"10.1109\/43.945309"},{"key":"3","first-page":"133","article-title":"Within-Die gate delay variability measurement using re-configurable ring oscillator","author":"das","year":"2008","journal-title":"Proc of IEEE Custom Integrated Circuits Conf"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2011.6139181"},{"key":"1","doi-asserted-by":"publisher","DOI":"10.1109\/ICMTS.2003.1197464"},{"key":"10","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.1999.805765"},{"key":"7","article-title":"Small delay testing for tsvs in 3d ics","author":"lin","year":"2012","journal-title":"Proc Design Automation Conf"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1007\/s10836-007-0759-5"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1145\/1120725.1120800"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1109\/96.475271"},{"key":"9","doi-asserted-by":"publisher","DOI":"10.1109\/3DIC.2010.5751450"},{"key":"8","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2012.2236837"}],"event":{"name":"2013 IEEE International Test Conference (ITC)","start":{"date-parts":[[2013,9,6]]},"location":"Anaheim, CA, USA","end":{"date-parts":[[2013,9,13]]}},"container-title":["2013 IEEE International Test Conference (ITC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6646057\/6651860\/06651906.pdf?arnumber=6651906","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,22]],"date-time":"2017-03-22T22:25:52Z","timestamp":1490221552000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6651906\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2013,9]]},"references-count":15,"URL":"https:\/\/doi.org\/10.1109\/test.2013.6651906","relation":{},"subject":[],"published":{"date-parts":[[2013,9]]}}}