{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,6]],"date-time":"2024-09-06T08:47:37Z","timestamp":1725612457877},"reference-count":10,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2014,10]]},"DOI":"10.1109\/test.2014.7035324","type":"proceedings-article","created":{"date-parts":[[2015,2,11]],"date-time":"2015-02-11T22:21:10Z","timestamp":1423693270000},"page":"1-7","source":"Crossref","is-referenced-by-count":4,"title":["A Tag based solution for efficient utilization of efuse for memory repair"],"prefix":"10.1109","author":[{"given":"Harsharaj","family":"Ellur","sequence":"first","affiliation":[]},{"given":"Kalpesh","family":"Shah","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ISVLSI.2012.17"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/LED.2002.802657"},{"key":"ref10","first-page":"166","article-title":"Fuse area reduction based on quantitative yield analysis and effective chip cost","author":"garg","year":"2006","journal-title":"Proc IEEE Int Symp Defect Fault Toler VLSI Syst"},{"article-title":"Algorithm to encode and compress array redundancy data","year":"2007","author":"beattie","key":"ref6"},{"key":"ref5","article-title":"An On-Chip Self-Repair Calculation and Fusing Methodology","author":"anand","year":"2002","journal-title":"IEEE D&T"},{"article-title":"Method and apparatus for handling fuse data for repairing faulty elements","year":"2012","author":"khoja","key":"ref8"},{"article-title":"Architecture, System and Method for Compressing Repair Data in an Integrated Circuit Design","year":"2011","author":"darbinyan","key":"ref7"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2007.4405850"},{"key":"ref9","article-title":"Hierarchical, Physical-Aware, Built-In Self-Repair of Embedded Memories","author":"devanathan","year":"2013","journal-title":"Session 11 Design Automation Conference"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/2.976918"}],"event":{"name":"2014 IEEE International Test Conference (ITC)","start":{"date-parts":[[2014,10,20]]},"location":"Seattle, WA, USA","end":{"date-parts":[[2014,10,23]]}},"container-title":["2014 International Test Conference"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7024668\/7035243\/07035324.pdf?arnumber=7035324","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,24]],"date-time":"2017-03-24T05:18:06Z","timestamp":1490332686000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7035324\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2014,10]]},"references-count":10,"URL":"https:\/\/doi.org\/10.1109\/test.2014.7035324","relation":{},"subject":[],"published":{"date-parts":[[2014,10]]}}}