{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,9,17]],"date-time":"2025-09-17T15:54:52Z","timestamp":1758124492223},"reference-count":26,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2014,10]]},"DOI":"10.1109\/test.2014.7035332","type":"proceedings-article","created":{"date-parts":[[2015,2,11]],"date-time":"2015-02-11T22:21:10Z","timestamp":1423693270000},"page":"1-10","source":"Crossref","is-referenced-by-count":11,"title":["Vesuvius-3D: A 3D-DfT demonstrator"],"prefix":"10.1109","author":[{"given":"Erik Jan","family":"Marinissen","sequence":"first","affiliation":[]},{"given":"Bart","family":"De Wachter","sequence":"additional","affiliation":[]},{"given":"Stephen","family":"O'Loughlin","sequence":"additional","affiliation":[]},{"given":"Sergej","family":"Deutsch","sequence":"additional","affiliation":[]},{"given":"Christos","family":"Papameletis","sequence":"additional","affiliation":[]},{"given":"Tobias","family":"Burgherr","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"doi-asserted-by":"publisher","key":"ref10","DOI":"10.1007\/s10836-011-5269-9"},{"year":"2011","article-title":"Wide I\/O Single Data Rate (JEDEC Standard JESD229)","key":"ref11"},{"key":"ref12","first-page":"1","article-title":"DfT Architecture and ATPG for Interconnect Tests of JEDEC Wide-I\/O Memory-on-Logic Die Stacks","author":"deutsch","year":"2012","journal-title":"Proceedings IEEE International Test Conference (ITC)"},{"doi-asserted-by":"publisher","key":"ref13","DOI":"10.1109\/TEST.2013.6651893"},{"doi-asserted-by":"publisher","key":"ref14","DOI":"10.1109\/ETS.2013.6569350"},{"doi-asserted-by":"publisher","key":"ref15","DOI":"10.1109\/ETS.2011.52"},{"doi-asserted-by":"publisher","key":"ref16","DOI":"10.1109\/ATS.2011.58"},{"year":"2013","article-title":"IEEE Standard Test Access Port and Boundary-Scan Architecture","key":"ref17"},{"year":"2005","article-title":"IEEE Standard Testability Method for Embedded Core-based Integrated Circuits","key":"ref18"},{"doi-asserted-by":"publisher","key":"ref19","DOI":"10.1109\/MDT.2009.65"},{"doi-asserted-by":"publisher","key":"ref4","DOI":"10.1109\/TEST.2014.7035314"},{"doi-asserted-by":"publisher","key":"ref3","DOI":"10.1109\/VTS.2012.6231086"},{"year":"2010","author":"marinissen","article-title":"Test Access Architecture for TSV-Based 3D Stacked ICs","key":"ref6"},{"doi-asserted-by":"publisher","key":"ref5","DOI":"10.1109\/DATE.2010.5457087"},{"doi-asserted-by":"publisher","key":"ref8","DOI":"10.1109\/VTS.2010.5469556"},{"year":"2012","author":"marinissen","article-title":"Test Access Architecture for TSV-Based 3D Stacked ICs","key":"ref7"},{"doi-asserted-by":"publisher","key":"ref2","DOI":"10.1109\/TEST.2011.6139180"},{"doi-asserted-by":"publisher","key":"ref9","DOI":"10.1109\/3DIC.2010.5751450"},{"key":"ref1","doi-asserted-by":"crossref","DOI":"10.1002\/9783527623051","author":"garrou","year":"2008","journal-title":"Handbook of 3D Integration-Technology and Applications of 3D Integrated Circuits"},{"doi-asserted-by":"publisher","key":"ref20","DOI":"10.1147\/rd.404.0461"},{"key":"ref22","first-page":"278","article-title":"Process Related Challenges for 3D Face to Face Stacking Test Vehicles Using a 40\/50m Pitch CuSn Microbump Configuration","author":"bogaerts","year":"2012","journal-title":"Proc Electron Packag Technol Conf (EPTC)"},{"doi-asserted-by":"publisher","key":"ref21","DOI":"10.1109\/ICCD.1996.563530"},{"doi-asserted-by":"publisher","key":"ref24","DOI":"10.1109\/ISCAS.1989.100747"},{"key":"ref23","first-page":"1122","article-title":"Key Elements for Sub-50m Pitch Micro Bump Processes","author":"de vos","year":"2013","journal-title":"Proc Electronic Components Technology Conf (ECTC)"},{"year":"0","author":"adham","journal-title":"IEEE P1838 Web Site","key":"ref26"},{"doi-asserted-by":"publisher","key":"ref25","DOI":"10.1016\/S0026-2692(00)00089-6"}],"event":{"name":"2014 IEEE International Test Conference (ITC)","start":{"date-parts":[[2014,10,20]]},"location":"Seattle, WA, USA","end":{"date-parts":[[2014,10,23]]}},"container-title":["2014 International Test Conference"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7024668\/7035243\/07035332.pdf?arnumber=7035332","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2019,8,20]],"date-time":"2019-08-20T21:27:24Z","timestamp":1566336444000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7035332\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2014,10]]},"references-count":26,"URL":"https:\/\/doi.org\/10.1109\/test.2014.7035332","relation":{},"subject":[],"published":{"date-parts":[[2014,10]]}}}