{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,7,27]],"date-time":"2025-07-27T07:53:07Z","timestamp":1753602787827,"version":"3.28.0"},"reference-count":8,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2015,10]]},"DOI":"10.1109\/test.2015.7342412","type":"proceedings-article","created":{"date-parts":[[2015,12,3]],"date-time":"2015-12-03T16:11:39Z","timestamp":1449159099000},"page":"1-10","source":"Crossref","is-referenced-by-count":4,"title":["Automated testing of bare die-to-die stacks"],"prefix":"10.1109","author":[{"given":"Erik Jan","family":"Marinissen","sequence":"first","affiliation":[]},{"given":"Bart","family":"De Wachter","sequence":"additional","affiliation":[]},{"given":"Teng","family":"Wang","sequence":"additional","affiliation":[]},{"given":"Jens","family":"Fiedler","sequence":"additional","affiliation":[]},{"given":"Jorg","family":"Kiesewetter","sequence":"additional","affiliation":[]},{"given":"Karsten","family":"Stoll","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"crossref","DOI":"10.1002\/9783527623051","author":"garrou","year":"2008","journal-title":"Handbook of 3D Integration-Technology and Applications of 3D Integrated Circuits"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ICICDT.2007.4299568"},{"journal-title":"Method and Prober for Contacting a Contact Area with a Contact Tip","year":"2006","author":"schneidewind","key":"ref6"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ETSYM.2010.5512785"},{"journal-title":"SEMI SEMI G74–0669 Specification for Tape Frame for 300mm Wafers Semiconductor Equipment and Materials International","year":"1999","key":"ref8"},{"journal-title":"Method and Arrangement for Positioning a Probe Card","year":"2010","author":"kanev","key":"ref7"},{"key":"ref2","doi-asserted-by":"crossref","first-page":"1214","DOI":"10.1109\/JPROC.2006.873612","article-title":"Three-Dimensional Integrated Circuits and the Future of System-on-Chip Designs","volume":"94","author":"robertpatti","year":"2006","journal-title":"Proceedings of the IEEE"},{"key":"ref1","first-page":"1277","article-title":"Challenges and Emerging Solutions in Testing TSV-Based 2.5D-and 3D-Stacked ICs","author":"janmarinissen","year":"2012","journal-title":"Proceedings Design Automation and Test in Europe (DATE)"}],"event":{"name":"2015 IEEE International Test Conference (ITC)","start":{"date-parts":[[2015,10,6]]},"location":"Anaheim, CA, USA","end":{"date-parts":[[2015,10,8]]}},"container-title":["2015 IEEE International Test Conference (ITC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7331771\/7342364\/07342412.pdf?arnumber=7342412","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2019,9,2]],"date-time":"2019-09-02T01:14:58Z","timestamp":1567386898000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7342412\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015,10]]},"references-count":8,"URL":"https:\/\/doi.org\/10.1109\/test.2015.7342412","relation":{},"subject":[],"published":{"date-parts":[[2015,10]]}}}