{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,4]],"date-time":"2024-09-04T13:36:36Z","timestamp":1725456996823},"reference-count":25,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2016,11]]},"DOI":"10.1109\/test.2016.7805846","type":"proceedings-article","created":{"date-parts":[[2017,1,5]],"date-time":"2017-01-05T17:22:46Z","timestamp":1483636966000},"page":"1-9","source":"Crossref","is-referenced-by-count":0,"title":["Supply-voltage optimization to account for process variations in high-volume manufacturing testing"],"prefix":"10.1109","author":[{"given":"Gurunath","family":"Kadam","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Markus","family":"Rudack","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Krishnendu","family":"Chakrabarty","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Juergen","family":"Alt","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"crossref","DOI":"10.1007\/978-1-4757-3799-8","author":"santner","year":"2003","journal-title":"The Design and Analysis of Computer Experiments"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.1996.556983"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.1993.470686"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/VTS.2001.923459"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2015.2397934"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/VTS.2012.6231090"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/VTEST.2004.1299224"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2004.1387387"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1145\/1687399.1687480"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/ASMC.2012.6212859"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2009.2029113"},{"key":"ref3","first-page":"309","article-title":"Random and systematic defect analysis using IDDQ signature analysis for understanding fails and guiding test decisions","author":"nigh","year":"2004","journal-title":"Test Conference 2004 Proceedings ITC 2004 International"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2002.1041819"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2014.2326081"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ETS.2014.6847806"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ATS.2012.14"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2005.1583988"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1561\/1000000008"},{"year":"0","key":"ref1","article-title":"International Technology Roadmap for Semiconductors (ITRS), 2014"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1080\/00401706.2000.10485979"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2005.881006"},{"journal-title":"Design and Analysis of Experiments","year":"2006","author":"montgomery","key":"ref21"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1007\/s13538-011-0052-z"},{"year":"0","key":"ref23"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/IITC.2014.6831893"}],"event":{"name":"2016 IEEE International Test Conference (ITC)","start":{"date-parts":[[2016,11,15]]},"location":"Fort Worth, TX, USA","end":{"date-parts":[[2016,11,17]]}},"container-title":["2016 IEEE International Test Conference (ITC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7794484\/7805805\/07805846.pdf?arnumber=7805846","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2019,9,17]],"date-time":"2019-09-17T02:07:23Z","timestamp":1568686043000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7805846\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2016,11]]},"references-count":25,"URL":"https:\/\/doi.org\/10.1109\/test.2016.7805846","relation":{},"subject":[],"published":{"date-parts":[[2016,11]]}}}