{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,5]],"date-time":"2024-09-05T10:07:54Z","timestamp":1725530874447},"reference-count":22,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2016,11]]},"DOI":"10.1109\/test.2016.7805848","type":"proceedings-article","created":{"date-parts":[[2017,1,5]],"date-time":"2017-01-05T22:22:46Z","timestamp":1483654966000},"page":"1-8","source":"Crossref","is-referenced-by-count":0,"title":["Online slack-time binning for IO-registered die-to-die interconnects"],"prefix":"10.1109","author":[{"given":"Chih-Chieh","family":"Zheng","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Shi-Yu","family":"Huang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Shyue-Kung","family":"Lu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ting-Chi","family":"Wang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Kun-Han","family":"Tsai","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Wu-Tung","family":"Cheng","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS.2012.6241859"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/VTS.2011.5783749"},{"key":"ref12","article-title":"Small Delay Testing for TSVs in 3D ICs","author":"lin","year":"2012","journal-title":"Proc Design Automation Conf"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1145\/2228360.2228545"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/ATS.2015.21"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2009.139"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/MDT.2009.152"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2008.917502"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2014.2366876"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/ATS.2014.39"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2014.6897409"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2010.5490883"},{"key":"ref6","first-page":"166","article-title":"TSV redundancy: Architecture and Design Issues in 3D IC","author":"hsieh","year":"2010","journal-title":"Proc of IEEE Design Automation and Test in Europe"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2009.2034408"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/DFT.2013.6653610"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1145\/2463209.2488824"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS.2011.5784499"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2012.6248850"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2010.2101089"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2015.7342406"},{"journal-title":"Chip Implementation Center CIC Taiwan Document No CIC-DSD-RD-08-01","article-title":"CIC Reference Flow for Cell-based IC Design","year":"2008","key":"ref22"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/VTS.2015.7116292"}],"event":{"name":"2016 IEEE International Test Conference (ITC)","start":{"date-parts":[[2016,11,15]]},"location":"Fort Worth, TX, USA","end":{"date-parts":[[2016,11,17]]}},"container-title":["2016 IEEE International Test Conference (ITC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7794484\/7805805\/07805848.pdf?arnumber=7805848","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,1,21]],"date-time":"2017-01-21T05:01:24Z","timestamp":1484974884000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7805848\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2016,11]]},"references-count":22,"URL":"https:\/\/doi.org\/10.1109\/test.2016.7805848","relation":{},"subject":[],"published":{"date-parts":[[2016,11]]}}}