{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,8]],"date-time":"2026-05-08T15:55:17Z","timestamp":1778255717347,"version":"3.51.4"},"reference-count":15,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2016,11]]},"DOI":"10.1109\/test.2016.7805871","type":"proceedings-article","created":{"date-parts":[[2017,1,5]],"date-time":"2017-01-05T17:22:46Z","timestamp":1483636966000},"page":"1-8","source":"Crossref","is-referenced-by-count":2,"title":["Active reliability monitor: Defect level extrinsic reliability monitoring on 22nm POWER8 and zSeries processors"],"prefix":"10.1109","author":[{"given":"Michael","family":"Johnson","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Brian","family":"Noble","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Mark","family":"Johnson","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jim","family":"Crafts","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Cynthia","family":"Manya","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"John","family":"Deforge","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/MDT.2006.38"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TIM.2011.2122430"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2002.1041820"},{"key":"ref13","author":"eckelman","year":"2006","journal-title":"Method and apparatus for abist diagnostics"},{"key":"ref14","author":"dreibelbis","year":"1992","journal-title":"Built-In Self Test for Integrated Circuits"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/RELPHY.2005.1493199"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/RELPHY.2005.1493125"},{"key":"ref3","doi-asserted-by":"crossref","first-page":"1","DOI":"10.1109\/RELPHY.1999.761584","article-title":"Microprocessor reliability performance as a function of die location for a 0.25 mu., five layer metal emos logic process","author":"riordan","year":"1999","journal-title":"Reliability Physics Symposium Proceedings 1999 37th Annual 1999 IEEE International"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/RELPHY.1998.670671"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/RELPHY.2004.1315318"},{"key":"ref8","first-page":"309","article-title":"Random and systematic defect analysis using iddq signature analysis for understanding fails and guiding test decisions","author":"nigh","year":"2004","journal-title":"Test Conference 2004 Proceedings ITC 2004 International"},{"key":"ref7","doi-asserted-by":"crossref","first-page":"69","DOI":"10.1109\/VTS.2002.1011113","article-title":"Statistical post-processing at wafersort-an alternative to burn-in and a manufacturable solution to test limit setting for sub-micron technologies","author":"madge","year":"2002","journal-title":"VLSI Test Symposium 2002 (VTS 2002) Proceedings 20th IEEE"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/RELPHY.2006.251278"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/MDT.2006.53"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2003.1270827"}],"event":{"name":"2016 IEEE International Test Conference (ITC)","location":"Fort Worth, TX, USA","start":{"date-parts":[[2016,11,15]]},"end":{"date-parts":[[2016,11,17]]}},"container-title":["2016 IEEE International Test Conference (ITC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7794484\/7805805\/07805871.pdf?arnumber=7805871","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,25]],"date-time":"2017-06-25T03:24:40Z","timestamp":1498361080000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7805871\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2016,11]]},"references-count":15,"URL":"https:\/\/doi.org\/10.1109\/test.2016.7805871","relation":{},"subject":[],"published":{"date-parts":[[2016,11]]}}}