{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,11,4]],"date-time":"2025-11-04T10:37:29Z","timestamp":1762252649462},"reference-count":10,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2017,10]]},"DOI":"10.1109\/test.2017.8242069","type":"proceedings-article","created":{"date-parts":[[2018,1,1]],"date-time":"2018-01-01T16:33:50Z","timestamp":1514824430000},"page":"1-10","source":"Crossref","is-referenced-by-count":6,"title":["Single-pin test control for Big A, little D devices"],"prefix":"10.1109","author":[{"given":"Michael","family":"Laisne","sequence":"first","affiliation":[]},{"given":"Hans Martin","family":"von Staudt","sequence":"additional","affiliation":[]},{"given":"Sourabh","family":"Bhalerao","sequence":"additional","affiliation":[]},{"given":"Mark","family":"Eason","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/IMS3TW.2015.7177859"},{"journal-title":"IEEE Standard for Reduced-pin and Enhanced-functionality Test Access Port and Boundary Scan Architecture","year":"0","key":"ref3"},{"year":"0","key":"ref10"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2016.7417970"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2010.5699242"},{"journal-title":"Application Note 74","article-title":"Reading and Writing 1-Wire&#x00AE; Devices Through Serial Interfaces","year":"2009","key":"ref8"},{"key":"ref7","article-title":"A Timestamping Method Using Reduced Cost ADC Hardware","author":"lyons","year":"2010","journal-title":"Proceedings IEEE Int Test Conference"},{"journal-title":"IEEE Standard Test Access Port and Boundary-Scan Architecture","year":"0","key":"ref2"},{"key":"ref9","article-title":"Single wire data signal using comparators","author":"laisne","year":"2017","journal-title":"USI5\/405 151 USPTO"},{"journal-title":"IEEE Standard for Access and Control of Instrumentation Embedded within a Semiconductor Device","year":"0","key":"ref1"}],"event":{"name":"2017 IEEE International Test Conference (ITC)","start":{"date-parts":[[2017,10,31]]},"location":"Fort Worth, TX","end":{"date-parts":[[2017,11,2]]}},"container-title":["2017 IEEE International Test Conference (ITC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8227522\/8242015\/08242069.pdf?arnumber=8242069","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2018,2,5]],"date-time":"2018-02-05T17:35:18Z","timestamp":1517852118000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/8242069\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2017,10]]},"references-count":10,"URL":"https:\/\/doi.org\/10.1109\/test.2017.8242069","relation":{},"subject":[],"published":{"date-parts":[[2017,10]]}}}