{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,11,5]],"date-time":"2025-11-05T11:14:54Z","timestamp":1762341294448,"version":"3.37.3"},"reference-count":45,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"4","license":[{"start":{"date-parts":[[2021,10,1]],"date-time":"2021-10-01T00:00:00Z","timestamp":1633046400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2021,10,1]],"date-time":"2021-10-01T00:00:00Z","timestamp":1633046400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2021,10,1]],"date-time":"2021-10-01T00:00:00Z","timestamp":1633046400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"name":"NYUAD","award":["RE218"],"award-info":[{"award-number":["RE218"]}]},{"name":"NYU\/NYUAD joint Center for Cybersecurity"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Emerg. Topics Comput."],"published-print":{"date-parts":[[2021,10,1]]},"DOI":"10.1109\/tetc.2019.2933572","type":"journal-article","created":{"date-parts":[[2019,8,6]],"date-time":"2019-08-06T20:06:00Z","timestamp":1565121960000},"page":"1815-1834","source":"Crossref","is-referenced-by-count":23,"title":["A Modern Approach to IP Protection and Trojan Prevention: Split Manufacturing for 3D ICs and Obfuscation of Vertical Interconnects"],"prefix":"10.1109","volume":"9","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-8975-2414","authenticated-orcid":false,"given":"Satwik","family":"Patnaik","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Mohammed","family":"Ashraf","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-0782-0397","authenticated-orcid":false,"given":"Ozgur","family":"Sinanoglu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-5093-2939","authenticated-orcid":false,"given":"Johann","family":"Knechtel","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"doi-asserted-by":"publisher","key":"ref39","DOI":"10.1109\/TVLSI.2017.2670508"},{"year":"2011","key":"ref38"},{"doi-asserted-by":"publisher","key":"ref33","DOI":"10.1109\/TIFS.2017.2658544"},{"doi-asserted-by":"publisher","key":"ref32","DOI":"10.1109\/ISVLSI.2017.58"},{"doi-asserted-by":"publisher","key":"ref31","DOI":"10.1145\/2966986.2967012"},{"doi-asserted-by":"publisher","key":"ref30","DOI":"10.1145\/2966986.2967065"},{"year":"2011","key":"ref37"},{"year":"2019","key":"ref36"},{"doi-asserted-by":"publisher","key":"ref35","DOI":"10.1109\/TVLSI.2012.2226762"},{"doi-asserted-by":"publisher","key":"ref34","DOI":"10.1145\/3060403.3060588"},{"key":"ref10","first-page":"495","article-title":"Securing computer hardware using 3D integrated circuit (IC) technology and split manufacturing for obfuscation","author":"imeson","year":"2013","journal-title":"Proc Usenix Security Symp"},{"doi-asserted-by":"publisher","key":"ref40","DOI":"10.1109\/DFT.2015.7315145"},{"doi-asserted-by":"publisher","key":"ref11","DOI":"10.1109\/ASPDAC.2018.8297316"},{"doi-asserted-by":"publisher","key":"ref12","DOI":"10.1145\/3177540.3178244"},{"doi-asserted-by":"publisher","key":"ref13","DOI":"10.1145\/2966986.2967013"},{"doi-asserted-by":"publisher","key":"ref14","DOI":"10.1109\/TCPMT.2017.2677963"},{"doi-asserted-by":"publisher","key":"ref15","DOI":"10.7873\/DATE.2013.261"},{"doi-asserted-by":"publisher","key":"ref16","DOI":"10.1109\/TVLSI.2017.2787754"},{"doi-asserted-by":"publisher","key":"ref17","DOI":"10.1145\/3195970.3196100"},{"doi-asserted-by":"publisher","key":"ref18","DOI":"10.1109\/ASPDAC.2018.8297314"},{"year":"2008","article-title":"3D-ICs and integrated circuit security","key":"ref19"},{"doi-asserted-by":"publisher","key":"ref28","DOI":"10.1109\/ICCAD.2017.8203758"},{"doi-asserted-by":"publisher","key":"ref4","DOI":"10.1145\/2755563"},{"key":"ref27","first-page":"128","article-title":"A secure camouflaged logic family using postmanufacturing programming with a 3.6 GHz adder prototype in 65 nm CMOS at 1V nominal VDD","author":"akkaya","year":"2018","journal-title":"Proc Int Solid-State Circuits Conf"},{"doi-asserted-by":"publisher","key":"ref3","DOI":"10.1145\/2906147"},{"doi-asserted-by":"publisher","key":"ref6","DOI":"10.2197\/ipsjtsldm.10.45"},{"doi-asserted-by":"publisher","key":"ref29","DOI":"10.1109\/HST.2015.7140252"},{"doi-asserted-by":"publisher","key":"ref5","DOI":"10.1145\/3312614.3312657"},{"doi-asserted-by":"publisher","key":"ref8","DOI":"10.1109\/ISSCC.2012.6176969"},{"doi-asserted-by":"publisher","key":"ref7","DOI":"10.1109\/JSSC.2012.2222814"},{"key":"ref2","article-title":"Meltdown","author":"lipp","year":"2018","journal-title":"ArXiv e-prints"},{"doi-asserted-by":"publisher","key":"ref9","DOI":"10.1038\/s41928-018-0146-5"},{"doi-asserted-by":"publisher","key":"ref1","DOI":"10.1145\/3240765.3240784"},{"doi-asserted-by":"publisher","key":"ref20","DOI":"10.1145\/3060403.3060500"},{"doi-asserted-by":"publisher","key":"ref45","DOI":"10.1145\/1807167.1807218"},{"doi-asserted-by":"publisher","key":"ref22","DOI":"10.1109\/AsianHOST.2018.8607176"},{"doi-asserted-by":"publisher","key":"ref21","DOI":"10.1109\/MC.2017.121"},{"year":"2017","key":"ref42"},{"doi-asserted-by":"publisher","key":"ref24","DOI":"10.1145\/2508859.2516656"},{"doi-asserted-by":"publisher","key":"ref41","DOI":"10.23919\/DATE.2018.8342144"},{"key":"ref23","first-page":"799","article-title":"Hardware-efficient logic camouflaging for monolithic 3D ICs","volume":"65","author":"yan","year":"2018","journal-title":"Trans Circuits Syst"},{"doi-asserted-by":"publisher","key":"ref44","DOI":"10.1109\/TIFS.2016.2520910"},{"doi-asserted-by":"publisher","key":"ref26","DOI":"10.1109\/ETS.2016.7519286"},{"year":"2019","key":"ref43"},{"doi-asserted-by":"publisher","key":"ref25","DOI":"10.1145\/2902961.2903000"}],"container-title":["IEEE Transactions on Emerging Topics in Computing"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6245516\/9635600\/08789529.pdf?arnumber=8789529","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,5,10]],"date-time":"2022-05-10T14:53:49Z","timestamp":1652194429000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8789529\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2021,10,1]]},"references-count":45,"journal-issue":{"issue":"4"},"URL":"https:\/\/doi.org\/10.1109\/tetc.2019.2933572","relation":{},"ISSN":["2168-6750","2376-4562"],"issn-type":[{"type":"electronic","value":"2168-6750"},{"type":"electronic","value":"2376-4562"}],"subject":[],"published":{"date-parts":[[2021,10,1]]}}}