{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,10,7]],"date-time":"2026-10-07T17:31:48Z","timestamp":1791394308004,"version":"4.3.3"},"reference-count":30,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"1","license":[{"start":{"date-parts":[[2011,1,1]],"date-time":"2011-01-01T00:00:00Z","timestamp":1293840000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Ind. Electron."],"published-print":{"date-parts":[[2011,1]]},"DOI":"10.1109\/tie.2010.2048292","type":"journal-article","created":{"date-parts":[[2010,5,10]],"date-time":"2010-05-10T13:31:41Z","timestamp":1273498301000},"page":"21-28","source":"Crossref","is-referenced-by-count":187,"title":["Efficiency Impact of Silicon Carbide Power Electronics for Modern Wind Turbine Full Scale Frequency Converter"],"prefix":"10.1109","volume":"58","author":[{"given":"Hui","family":"Zhang","sequence":"first","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Leon M.","family":"Tolbert","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref30","article-title":"rohm exhibits new sic power module","author":"nezu","year":"2009","journal-title":"Technology Newsline"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/IECON.2008.4758298"},{"key":"ref11","author":"casady","year":"2008","journal-title":"SiC Power Device Development for Clean Energy Application"},{"key":"ref12","author":"wolk","year":"2008","journal-title":"Proceedings of High Megawatt Power Converter Technology R&D Roadmap Workshop"},{"key":"ref13","first-page":"2231","article-title":"SiC's potential impact on the design of wind generation system","author":"zhang","year":"2008","journal-title":"Proc IEEE Ind Electron Conf"},{"key":"ref14","author":"bywaters","year":"2005","journal-title":"Northern power systems WindPACT drive train"},{"key":"ref15","author":"marckx","year":"2005","journal-title":"Breakthrough in Power Electronics From SiC"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/PESC.1995.474929"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/PESC.2004.1355283"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/63.388002"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/IECON.2001.975927"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/PESC.2008.4592725"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2007.907672"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/APEC.2009.4802729"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2006.885456"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2006.878319"},{"key":"ref29","year":"2009","journal-title":"Cree and Powerex Develop New SiC Power Switches for Next-Generation Military Systems"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2006.878326"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2006.882025"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2008.2005244"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/IECON.2008.4757959"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ICIEA.2009.5138193"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2008.2005940"},{"key":"ref20","author":"zhang","year":"2007","journal-title":"Electro-thermal modeling of SiC power electronic systems"},{"key":"ref22","year":"0","journal-title":"Datasheet of silicon carbide Schottky diode-C2D10120"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/IAS.2006.256544"},{"key":"ref24","year":"0","journal-title":"Conrad Heatsink 2005 Catalog"},{"key":"ref23","year":"0","journal-title":"Datasheet of Silicon IGBT ModuleDIM1600FSM17"},{"key":"ref26","first-page":"127","article-title":"4H-SiC high power SIJFET module","author":"sugawara","year":"2003","journal-title":"Proc IEEE 15th Int Symp Power Semicond Devices ICs"},{"key":"ref25","year":"0","journal-title":"Manufaturer page of Hi-Contact liquid cold plates from Aavid Thermalloy LLC"}],"container-title":["IEEE Transactions on Industrial Electronics"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/41\/5662271\/05456158.pdf?arnumber=5456158","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2021,10,11]],"date-time":"2021-10-11T00:43:43Z","timestamp":1633913023000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/5456158\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2011,1]]},"references-count":30,"journal-issue":{"issue":"1"},"URL":"https:\/\/doi.org\/10.1109\/tie.2010.2048292","relation":{},"ISSN":["0278-0046","1557-9948"],"issn-type":[{"value":"0278-0046","type":"print"},{"value":"1557-9948","type":"electronic"}],"subject":[],"published":{"date-parts":[[2011,1]]}}}