{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,7,22]],"date-time":"2024-07-22T19:18:38Z","timestamp":1721675918728},"reference-count":33,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"1","license":[{"start":{"date-parts":[[2015,1,1]],"date-time":"2015-01-01T00:00:00Z","timestamp":1420070400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Ind. Electron."],"published-print":{"date-parts":[[2015,1]]},"DOI":"10.1109\/tie.2014.2327597","type":"journal-article","created":{"date-parts":[[2014,5,30]],"date-time":"2014-05-30T18:24:57Z","timestamp":1401474297000},"page":"30-39","source":"Crossref","is-referenced-by-count":21,"title":["New Hexagonal Three-Phase Voltage-Source Converter Topology for High-Power Applications"],"prefix":"10.1109","volume":"62","author":[{"given":"Aitor","family":"Laka","sequence":"first","affiliation":[]},{"given":"Jon Andoni","family":"Barrena","sequence":"additional","affiliation":[]},{"given":"Javier","family":"Chivite-Zabalza","sequence":"additional","affiliation":[]},{"given":"Miguel Angel","family":"Rodriguez Vidal","sequence":"additional","affiliation":[]},{"given":"Pedro","family":"Izurza-Moreno","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/9780470546284"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1002\/0471773719"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/63.145137"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/DRPT.2008.4523691"},{"key":"ref10","doi-asserted-by":"crossref","first-page":"1417","DOI":"10.1109\/TIE.2011.2166233","article-title":"D-STATCOM with positive-sequence admittance and negative-sequence conductance to mitigate voltage fluctuations in high-level penetration of distributed-generation systems","volume":"60","author":"tzung-lin","year":"2013","journal-title":"IEEE Trans Ind Electron"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2012.2210378"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2012.2211431"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2009.2030767"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2014.2300834"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2012.2218555"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2014.2301798"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2010.2040565"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2012.2218259"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2008.2005059"},{"key":"ref28","year":"2001","journal-title":"Convertible Static Compensator (CSC) for New York Power Authority"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2007.904243"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/TEC.2012.2229282"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2012.2191751"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2012.2233694"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/TPWRD.2013.2253807"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2012.2237415"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2011.2143431"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2009.2036619"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2011.2159242"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2012.2185023"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2011.2162213"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2008.921175"},{"key":"ref22","first-page":"47","article-title":"Power quality improvement at medium-voltage grids using hexagram active power filter","author":"jun","year":"0","journal-title":"25th Annu Proc 25th Annu IEEE APEC"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/PES.2009.5275355"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2010.2052536"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2010.2090830"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2012.2192753"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2002.801069"}],"container-title":["IEEE Transactions on Industrial Electronics"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/41\/6994311\/06823718.pdf?arnumber=6823718","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,1,12]],"date-time":"2022-01-12T15:59:30Z","timestamp":1642003170000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6823718\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015,1]]},"references-count":33,"journal-issue":{"issue":"1"},"URL":"https:\/\/doi.org\/10.1109\/tie.2014.2327597","relation":{},"ISSN":["0278-0046","1557-9948"],"issn-type":[{"value":"0278-0046","type":"print"},{"value":"1557-9948","type":"electronic"}],"subject":[],"published":{"date-parts":[[2015,1]]}}}