{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,2,21]],"date-time":"2025-02-21T09:58:45Z","timestamp":1740131925870,"version":"3.37.3"},"reference-count":31,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"12","license":[{"start":{"date-parts":[[2015,12,1]],"date-time":"2015-12-01T00:00:00Z","timestamp":1448928000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"}],"funder":[{"DOI":"10.13039\/501100004837","name":"Ministerio de Ciencia e Innovaci\u00f3n","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100004837","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100002809","name":"Generalitat de Catalunya","doi-asserted-by":"publisher","award":["2014-SGR-1596"],"award-info":[{"award-number":["2014-SGR-1596"]}],"id":[{"id":"10.13039\/501100002809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Ind. Electron."],"published-print":{"date-parts":[[2015,12]]},"DOI":"10.1109\/tie.2015.2455024","type":"journal-article","created":{"date-parts":[[2015,7,10]],"date-time":"2015-07-10T18:38:15Z","timestamp":1436553495000},"page":"7774-7785","source":"Crossref","is-referenced-by-count":10,"title":["Functional and Consumption Analysis of Integrated Circuits Supplied by Inductive Power Transfer by Powering Modulation and Lock-In Infrared Imaging"],"prefix":"10.1109","volume":"62","author":[{"given":"J.","family":"Leon","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"X.","family":"Perpina","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"J.","family":"Sacristan","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"M.","family":"Vellvehi","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"A.","family":"Baldi","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"X.","family":"Jorda","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1063\/1.3657154"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/IECON.2011.6119880"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TAP.2013.2279832"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2013.2260097"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.3390\/s100404071"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1049\/el:20092033"},{"key":"ref14","article-title":"Wireless powering of single-chip systems with integrated coil and external wire-loop resonator","volume":"92","author":"segura","year":"2008","journal-title":"Appl Phys Lett"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2008.921746"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2008.920182"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/JMEMS.2014.2332254"},{"journal-title":"RFID Forecasts Players and Opportunities 2014–2024","year":"2014","author":"das","key":"ref18"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TETC.2015.2390034"},{"key":"ref28","doi-asserted-by":"crossref","DOI":"10.1088\/0022-3727\/41\/15\/155508","article-title":"Steady-state sinusoidal thermal characterization at chip level by internal infrared-laser deflection","volume":"41","author":"perpi\u00f1\u00e0","year":"2008","journal-title":"J Phys D Appl Phys"},{"key":"ref4","doi-asserted-by":"crossref","first-page":"2225","DOI":"10.1109\/TIE.2013.2273472","article-title":"Wireless power transmission with self-regulated output voltage for biomedical implant","volume":"61","author":"dukju","year":"2014","journal-title":"IEEE Trans Ind Electron"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1063\/1.4793665"},{"key":"ref3","doi-asserted-by":"crossref","first-page":"776","DOI":"10.1109\/TIE.2013.2257149","article-title":"An accurate frequency tracking method based on short current detection for inductive power transfer system","volume":"61","author":"xin","year":"2014","journal-title":"IEEE Trans Ind Electron"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2013.2281167"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1088\/0022-3727\/47\/5\/055102"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1088\/0957-0233\/22\/8\/082001"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2014.2311380"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2014.2301762"},{"key":"ref2","doi-asserted-by":"crossref","first-page":"6691","DOI":"10.1109\/TIE.2014.2316247","article-title":"Inductive power transfer systems for PT-based ozone-driven circuit with flexible capacity operation and frequency-tracking mechanism","volume":"61","author":"shyh-jier","year":"2014","journal-title":"IEEE Trans Ind Electron"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2014.2308138"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2014.2303420"},{"key":"ref20","first-page":"1","article-title":"Reducing test cost for mixed signal circuits ‘from TOETS to ELESIS’","author":"azimane","year":"0","journal-title":"Proc IEEE Eur Test Symp"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2011.2158047"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2006.879793"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2013.2279373"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2013.2281166"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1016\/S0921-5107(01)01011-X"},{"key":"ref25","doi-asserted-by":"crossref","DOI":"10.1007\/978-3-642-02417-7","author":"breitenstein","year":"2010","journal-title":"Lock-in Thermography Basics and Use for Evaluating Electronic Devices and Materials"}],"container-title":["IEEE Transactions on Industrial Electronics"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/41\/7322317\/07154491.pdf?arnumber=7154491","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,8,12]],"date-time":"2023-08-12T04:54:43Z","timestamp":1691816083000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/7154491\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015,12]]},"references-count":31,"journal-issue":{"issue":"12"},"URL":"https:\/\/doi.org\/10.1109\/tie.2015.2455024","relation":{},"ISSN":["0278-0046","1557-9948"],"issn-type":[{"type":"print","value":"0278-0046"},{"type":"electronic","value":"1557-9948"}],"subject":[],"published":{"date-parts":[[2015,12]]}}}