{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,16]],"date-time":"2026-01-16T02:45:49Z","timestamp":1768531549188,"version":"3.49.0"},"reference-count":29,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"5","license":[{"start":{"date-parts":[[2020,5,1]],"date-time":"2020-05-01T00:00:00Z","timestamp":1588291200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2020,5,1]],"date-time":"2020-05-01T00:00:00Z","timestamp":1588291200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2020,5,1]],"date-time":"2020-05-01T00:00:00Z","timestamp":1588291200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100003725","name":"National Research Foundation of Korea","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100003725","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100003621","name":"Ministry of Science, ICT and Future Planning","doi-asserted-by":"publisher","award":["#NRF-2017R1A2A1A05001022"],"award-info":[{"award-number":["#NRF-2017R1A2A1A05001022"]}],"id":[{"id":"10.13039\/501100003621","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100003725","name":"National Research Foundation of Korea","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100003725","id-type":"DOI","asserted-by":"publisher"}]},{"name":"International Cooperation Program","award":["2016K2A9A1A03905116"],"award-info":[{"award-number":["2016K2A9A1A03905116"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Ind. Electron."],"published-print":{"date-parts":[[2020,5]]},"DOI":"10.1109\/tie.2019.2920606","type":"journal-article","created":{"date-parts":[[2019,6,7]],"date-time":"2019-06-07T20:05:07Z","timestamp":1559937907000},"page":"4163-4171","source":"Crossref","is-referenced-by-count":54,"title":["Classification of Faults in Multicore Cable via Time\u2013Frequency Domain Reflectometry"],"prefix":"10.1109","volume":"67","author":[{"ORCID":"https:\/\/orcid.org\/0000-0001-9041-6437","authenticated-orcid":false,"given":"Su Sik","family":"Bang","sequence":"first","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0001-8567-2567","authenticated-orcid":false,"given":"Yong-June","family":"Shin","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TEMC.2003.811305"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TIM.2005.858115"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2006.874018"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TASC.2016.2524520"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TPWRD.2017.2680459"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TIM.2017.2664578"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TASC.2018.2809441"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2018.2840529"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2018.2835386"},{"key":"ref19","first-page":"1","article-title":"Multicore cable fault diagnosis using cluster time-frequency domain reflectometry","author":"lee","year":"0","journal-title":"Proc IEEE Int Instrum Meas Technol Conf"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1145\/3065386"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2017.2721922"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/78.205752"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1007\/s12667-014-0129-1"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TDEI.2005.1522184"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1016\/S0893-6080(98)00116-6"},{"key":"ref5","year":"2012","journal-title":"IEEE Guide for Field Testing and Evaluation of the Insulation of Shielded Power Cable Systems Rated 5 kV and Above"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2005.858964"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TDEI.2009.5128527"},{"key":"ref2","author":"fantoni","year":"2004","journal-title":"NPP Wire System Aging Assessment and Condition Monitoring State-of-the-Art Report"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TIM.1974.4314245"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/MIE.2013.2287651"},{"key":"ref20","article-title":"Impact of filled strand conductor on connector temperatures of medium voltage joints","author":"parker","year":"0","journal-title":"Proc 9th Int Conf Insulated Power Cables"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1049\/cp.2013.0572"},{"key":"ref21","first-page":"823","article-title":"Diagnostic testing of thermally aged medium voltage XLPE cable joints","author":"mauseth","year":"0","journal-title":"Proc Conf Elect Insul and Dielectric Phenomena"},{"key":"ref24","author":"oughstun","year":"2009","journal-title":"Electromagnetic and Optical Pulse Propagation 2 Temporal Pulse Dynamics in Dispersive Attenuative Media"},{"key":"ref23","author":"solomon","year":"2011","journal-title":"Fundamentals of Digital Image Processing A Practical Approach with Examples in Matlab"},{"key":"ref26","author":"cohen","year":"1995","journal-title":"Time-Frequency Analysis"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.12989\/sss.2006.2.1.025"}],"container-title":["IEEE Transactions on Industrial Electronics"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/41\/8982108\/08733197.pdf?arnumber=8733197","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,4,27]],"date-time":"2022-04-27T13:54:38Z","timestamp":1651067678000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8733197\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2020,5]]},"references-count":29,"journal-issue":{"issue":"5"},"URL":"https:\/\/doi.org\/10.1109\/tie.2019.2920606","relation":{},"ISSN":["0278-0046","1557-9948"],"issn-type":[{"value":"0278-0046","type":"print"},{"value":"1557-9948","type":"electronic"}],"subject":[],"published":{"date-parts":[[2020,5]]}}}