{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,27]],"date-time":"2026-03-27T07:55:10Z","timestamp":1774598110051,"version":"3.50.1"},"reference-count":28,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"8","license":[{"start":{"date-parts":[[2020,8,1]],"date-time":"2020-08-01T00:00:00Z","timestamp":1596240000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2020,8,1]],"date-time":"2020-08-01T00:00:00Z","timestamp":1596240000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2020,8,1]],"date-time":"2020-08-01T00:00:00Z","timestamp":1596240000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"name":"Tianjin Natural Science Foundations of China","award":["17JCQNJC01100"],"award-info":[{"award-number":["17JCQNJC01100"]}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["61501319"],"award-info":[{"award-number":["61501319"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["51775377"],"award-info":[{"award-number":["51775377"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"name":"National Key Research and Development Plan","award":["2017YFF0204800"],"award-info":[{"award-number":["2017YFF0204800"]}]},{"name":"Young Elite Scientists Sponsorship Program by Cast of China","award":["2016QNRC001"],"award-info":[{"award-number":["2016QNRC001"]}]},{"DOI":"10.13039\/501100012165","name":"Key Technologies Research and Development Program","doi-asserted-by":"publisher","award":["18YFZCGX00920"],"award-info":[{"award-number":["18YFZCGX00920"]}],"id":[{"id":"10.13039\/501100012165","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100013290","name":"National Key Research and Development Program of China Stem Cell and Translational Research","doi-asserted-by":"publisher","award":["2018YFF0212702"],"award-info":[{"award-number":["2018YFF0212702"]}],"id":[{"id":"10.13039\/501100013290","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Ind. Electron."],"published-print":{"date-parts":[[2020,8]]},"DOI":"10.1109\/tie.2019.2938476","type":"journal-article","created":{"date-parts":[[2019,9,5]],"date-time":"2019-09-05T19:50:21Z","timestamp":1567713021000},"page":"6864-6873","source":"Crossref","is-referenced-by-count":51,"title":["A Novel Fast Resonance Frequency Tracking Method Based on the Admittance Circle for Ultrasonic Transducers"],"prefix":"10.1109","volume":"67","author":[{"ORCID":"https:\/\/orcid.org\/0000-0001-7789-3204","authenticated-orcid":false,"given":"Jin-dong","family":"Wang","sequence":"first","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0002-0611-6501","authenticated-orcid":false,"given":"Jia-jia","family":"Jiang","sequence":"additional","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0002-2151-0785","authenticated-orcid":false,"given":"Fa-jie","family":"Duan","sequence":"additional","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0002-4516-5912","authenticated-orcid":false,"given":"Fu-min","family":"Zhang","sequence":"additional","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0003-2968-2888","authenticated-orcid":false,"given":"Wei","family":"liu","sequence":"additional","affiliation":[]},{"given":"Xing-hua","family":"Qu","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2007.892733"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1088\/0022-3727\/30\/16\/014"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TUFFC.2016.2633319"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2014.2308156"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TUFFC.2012.2180"},{"key":"ref15","first-page":"843","article-title":"Ultrasonic cutting with resonance tracking and vibration stabilization","author":"kuang","year":"2013","journal-title":"Proc Ultrason Symp"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1016\/j.ultras.2018.06.003"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1016\/j.ultras.2013.07.001"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2015.2462086"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2012.2210912"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/ICInfA.2014.6932721"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1016\/S0890-6955(97)00036-9"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2019.2921384"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1007\/s00170-016-8977-6"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2015.2500197"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2015.2436874"},{"key":"ref8","first-page":"691","article-title":"Ultrasonic power closed-loop control on wire bonder","author":"he","year":"2017","journal-title":"Proc Electron Packag Technol Conf"},{"key":"ref7","first-page":"543","article-title":"Design of LC resonant inverter for ultrasonic metal welding system","author":"tao","year":"2016","journal-title":"Proc Int Conf Smart Manuf Appl"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1016\/j.ultsonch.2015.05.004"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/58.911746"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TUFFC.2014.2932"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2018.2840503"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1016\/j.sna.2015.09.040"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.3390\/s17122832"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1016\/S0041-624X(01)00060-9"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2005.861125"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2017.2784350"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2017.2740827"}],"container-title":["IEEE Transactions on Industrial Electronics"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/41\/9062398\/08826003.pdf?arnumber=8826003","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,4,27]],"date-time":"2022-04-27T13:51:21Z","timestamp":1651067481000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8826003\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2020,8]]},"references-count":28,"journal-issue":{"issue":"8"},"URL":"https:\/\/doi.org\/10.1109\/tie.2019.2938476","relation":{},"ISSN":["0278-0046","1557-9948"],"issn-type":[{"value":"0278-0046","type":"print"},{"value":"1557-9948","type":"electronic"}],"subject":[],"published":{"date-parts":[[2020,8]]}}}