{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,8,4]],"date-time":"2026-08-04T03:41:09Z","timestamp":1785814869339,"version":"3.56.0"},"reference-count":44,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"4","license":[{"start":{"date-parts":[[2021,4,1]],"date-time":"2021-04-01T00:00:00Z","timestamp":1617235200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2021,4,1]],"date-time":"2021-04-01T00:00:00Z","timestamp":1617235200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2021,4,1]],"date-time":"2021-04-01T00:00:00Z","timestamp":1617235200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"name":"National Key Basic Research Program of China","award":["2015CB251004"],"award-info":[{"award-number":["2015CB251004"]}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["51490681"],"award-info":[{"award-number":["51490681"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Ind. Electron."],"published-print":{"date-parts":[[2021,4]]},"DOI":"10.1109\/tie.2020.2977563","type":"journal-article","created":{"date-parts":[[2020,3,6]],"date-time":"2020-03-06T22:12:51Z","timestamp":1583532771000},"page":"3033-3043","source":"Crossref","is-referenced-by-count":50,"title":["Fatigue Mechanism of Die-Attach Joints in IGBTs Under Low-Amplitude Temperature Swings Based on 3D Electro-Thermal-Mechanical FE Simulations"],"prefix":"10.1109","volume":"68","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-9711-1246","authenticated-orcid":false,"given":"Yongle","family":"Huang","sequence":"first","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Hongfei","family":"Deng","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yifei","family":"Luo","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Fei","family":"Xiao","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Binli","family":"Liu","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Xin","family":"Tang","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.1016\/j.cossms.2015.08.001"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1016\/j.intermet.2016.06.004"},{"key":"ref33","first-page":"63","article-title":"Finite element modeling predicts the effects of voids on thermal shock reliability and thermal resistance of power device","volume":"85","author":"chang","year":"2006","journal-title":"Weld J"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/33.56179"},{"key":"ref31","first-page":"193","article-title":"A study of B-P unified viscoplastic constitutive model","volume":"15","author":"zhao","year":"2002","journal-title":"Acta Metallurgica Sinica"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/JESTPE.2018.2871474"},{"key":"ref37","author":"lutz","year":"2013","journal-title":"Semiconductor Power Devices Physics Characteristics Reliability"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1109\/JESTPE.2018.2888506"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.6113\/JPE.2016.16.5.1843"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1016\/j.applthermaleng.2013.12.006"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2017.06.081"},{"key":"ref40","doi-asserted-by":"publisher","DOI":"10.1016\/j.intermet.2017.08.002"},{"key":"ref11","first-page":"1","article-title":"Solder fatigue at high-power IGBT modules","author":"sommer","year":"2006","journal-title":"Proc 4th Int Conf Integr Power Syst"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/ICEPT.2017.8046696"},{"key":"ref13","first-page":"289","article-title":"A study of the bonding-wire reliability on the chip surface electrode in IGBT","author":"ikeda","year":"2010","journal-title":"Proc Int Symp Power Semiconductor Devices"},{"key":"ref14","first-page":"1","article-title":"In-situ bond wire health monitoring circuit for IGBT power modules","author":"ji","year":"2012","journal-title":"Proc 6th IET Int Conf Power Electron Mach Drives"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2012.06.081"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/ISIE.2011.5984366"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/RELPHY.2000.843917"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TIA.2015.2407055"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2018.01.009"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2016.2546944"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ISPSD.2014.6856045"},{"key":"ref27","first-page":"1","article-title":"Model for power cycling lifetime of IGBT modules - various factors influencing lifetime","author":"bayerer","year":"2008","journal-title":"Proc 5th Int Conf Integr Power Electron Syst"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TCAPT.2003.815112"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/IECON.2013.6699187"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2018.03.008"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/PowerEng.2013.6889108"},{"key":"ref8","first-page":"1","article-title":"Observation of chip solder degradation by electrical measurements during power cycling","author":"hartmann","year":"2010","journal-title":"Proc 6th Int Conf Integr Power Electron Syst"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1002\/pip.800"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/EPE.2013.6634419"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/IPEMC.2016.7512797"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/SIELA.2016.7543003"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/ECCE.2017.8096728"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/THERMINIC.2013.6675197"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2011.2114313"},{"key":"ref42","doi-asserted-by":"publisher","DOI":"10.1109\/ICEPT.2006.359791"},{"key":"ref24","first-page":"2106","article-title":"New physical model for lifetime estimation of power modules","author":"kova?evi?","year":"2010","journal-title":"International Conference on Power Electronics and ECCE Asia"},{"key":"ref41","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2000.853299"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/TIA.2003.810661"},{"key":"ref44","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2016.01.002"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/SPEEDAM.2014.6872071"},{"key":"ref43","doi-asserted-by":"publisher","DOI":"10.1109\/ICEPT.2006.359796"},{"key":"ref25","first-page":"1","article-title":"The investigation of modified Norris-Landzberg acceleration models for reliablity assessment of ball grid array packages","author":"chung","year":"2010","journal-title":"Proc 5th Int Microsyst Pack Assem Cilrcuit Technology Conference"}],"container-title":["IEEE Transactions on Industrial Electronics"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/41\/9296386\/09027112.pdf?arnumber=9027112","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,5,10]],"date-time":"2022-05-10T14:48:58Z","timestamp":1652194138000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9027112\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2021,4]]},"references-count":44,"journal-issue":{"issue":"4"},"URL":"https:\/\/doi.org\/10.1109\/tie.2020.2977563","relation":{},"ISSN":["0278-0046","1557-9948"],"issn-type":[{"value":"0278-0046","type":"print"},{"value":"1557-9948","type":"electronic"}],"subject":[],"published":{"date-parts":[[2021,4]]}}}