{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,10,29]],"date-time":"2025-10-29T03:48:38Z","timestamp":1761709718963,"version":"3.37.3"},"reference-count":32,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"8","license":[{"start":{"date-parts":[[2021,8,1]],"date-time":"2021-08-01T00:00:00Z","timestamp":1627776000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2021,8,1]],"date-time":"2021-08-01T00:00:00Z","timestamp":1627776000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2021,8,1]],"date-time":"2021-08-01T00:00:00Z","timestamp":1627776000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"name":"Key-Area Research and Development Program of Guangdong Province","award":["2020B010173001"],"award-info":[{"award-number":["2020B010173001"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Ind. Electron."],"published-print":{"date-parts":[[2021,8]]},"DOI":"10.1109\/tie.2020.3005073","type":"journal-article","created":{"date-parts":[[2020,7,1]],"date-time":"2020-07-01T20:57:46Z","timestamp":1593637066000},"page":"7474-7484","source":"Crossref","is-referenced-by-count":25,"title":["Online Condition Monitoring for Bond Wire Degradation of IGBT Modules in Three-Level Neutral-Point-Clamped Converters"],"prefix":"10.1109","volume":"68","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-3840-4900","authenticated-orcid":false,"given":"Xulong","family":"Wang","sequence":"first","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0003-2849-7373","authenticated-orcid":false,"given":"Pengju","family":"Sun","sequence":"additional","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0002-9333-3968","authenticated-orcid":false,"given":"Lin","family":"Sun","sequence":"additional","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0002-1458-2801","authenticated-orcid":false,"given":"Quanming","family":"Luo","sequence":"additional","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0002-0212-1653","authenticated-orcid":false,"given":"Xiong","family":"Du","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2011.2178433"},{"key":"ref31","first-page":"1","article-title":"Using the chip as a temperature sensor—The influence of steep lateral temperature gradients on the VCE(T)-measurement","author":"schmidt","year":"2009","journal-title":"Proc 13th Eur Conf Power Electron Appl"},{"key":"ref30","first-page":"1","article-title":"A moving average filter based method of performance improvement for ultraviolet communication system","author":"luo","year":"2012","journal-title":"Proc 8th Int Symp Commun Syst Netw Digit Signal Process"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/IAS.1997.630841"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TIA.2003.810661"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1016\/S0168-874X(01)00094-4"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2016.2521899"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1016\/S0026-2714(03)00318-4"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2011.2114313"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2012.2196894"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2013.2251358"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2016.2621757"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2012.08.024"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2004.839831"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2010.2049377"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2013.2288334"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2009.2032430"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2014.2346485"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2005.847586"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TIA.2011.2124436"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/RELPHY.2007.369938"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1016\/S0026-2714(02)00042-2"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2007.907044"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ISIE.2011.5984366"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/MIE.2008.923519"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2012.2210249"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2016.2585669"},{"key":"ref21","doi-asserted-by":"crossref","first-page":"83","DOI":"10.1109\/TDMR.2012.2200485","article-title":"Study of bonding wire failure effects on external measurable signals of IGBT module","volume":"14","author":"wei","year":"2014","journal-title":"IEEE Trans Device Mater Rel"},{"key":"ref24","first-page":"3262","article-title":"In-situ diagnostics and prognostics of wire bonding faults in IGBT modules of three-level neutral-point-clamped inverters","author":"han","year":"2016","journal-title":"Proc IEEE 8th Int Power Electron Motion Control Conf"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2017.2652372"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2010.2080252"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2012.2183601"}],"container-title":["IEEE Transactions on Industrial Electronics"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/41\/9420632\/09130909.pdf?arnumber=9130909","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,5,10]],"date-time":"2022-05-10T14:49:38Z","timestamp":1652194178000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9130909\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2021,8]]},"references-count":32,"journal-issue":{"issue":"8"},"URL":"https:\/\/doi.org\/10.1109\/tie.2020.3005073","relation":{},"ISSN":["0278-0046","1557-9948"],"issn-type":[{"type":"print","value":"0278-0046"},{"type":"electronic","value":"1557-9948"}],"subject":[],"published":{"date-parts":[[2021,8]]}}}