{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,17]],"date-time":"2026-01-17T20:15:19Z","timestamp":1768680919065,"version":"3.49.0"},"reference-count":22,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"8","license":[{"start":{"date-parts":[[2021,8,1]],"date-time":"2021-08-01T00:00:00Z","timestamp":1627776000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2021,8,1]],"date-time":"2021-08-01T00:00:00Z","timestamp":1627776000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2021,8,1]],"date-time":"2021-08-01T00:00:00Z","timestamp":1627776000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["51905108"],"award-info":[{"award-number":["51905108"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["51675106"],"award-info":[{"award-number":["51675106"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["U1601202"],"award-info":[{"award-number":["U1601202"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"name":"Fund of Guangdong R&D Science and Technology","award":["2018B090906002"],"award-info":[{"award-number":["2018B090906002"]}]},{"DOI":"10.13039\/501100003453","name":"Natural Science Foundation of Guangdong Province","doi-asserted-by":"publisher","award":["2019A1515011796"],"award-info":[{"award-number":["2019A1515011796"]}],"id":[{"id":"10.13039\/501100003453","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Ind. Electron."],"published-print":{"date-parts":[[2021,8]]},"DOI":"10.1109\/tie.2020.3020018","type":"journal-article","created":{"date-parts":[[2020,9,2]],"date-time":"2020-09-02T20:15:51Z","timestamp":1599077751000},"page":"7252-7262","source":"Crossref","is-referenced-by-count":9,"title":["A VCM Active Actuation Method for Bonding Time Reduction in Chip Packaging Process"],"prefix":"10.1109","volume":"68","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-6439-2619","authenticated-orcid":false,"given":"Lanyu","family":"Zhang","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-5625-7751","authenticated-orcid":false,"given":"Jian","family":"Gao","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-6933-1209","authenticated-orcid":false,"given":"Yunbo","family":"He","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Xin","family":"Chen","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-4988-8894","authenticated-orcid":false,"given":"Yun","family":"Chen","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-2155-5235","authenticated-orcid":false,"given":"Hui","family":"Tang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-1927-1209","authenticated-orcid":false,"given":"Zhijun","family":"Yang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ICMEE.2010.5558519"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2016.2579502"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2017.2760342"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TCAPT.2009.2017380"},{"key":"ref14","first-page":"1","article-title":"Trajectory tracking controller of high precise positioning system based on iterative learning control with wavelet filtering method","author":"zhao","year":"0","journal-title":"Proc IEEE Int Conf Multisensor Fusion Inf Integr Intell Syst"},{"key":"ref15","first-page":"4343","article-title":"High-acceleration precision point-to-point motion control with look-ahead properties","volume":"58","author":"wu","year":"2010","journal-title":"IEEE Trans Ind Electron"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2007.894702"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/ROBOT.1993.292007"},{"key":"ref18","first-page":"3570","article-title":"Input shaping based vibration reduction for the flexible bonding arm of a LED die bonder","author":"chen","year":"0","journal-title":"Proc IEEE Proc 30th Chin Control Conf"},{"key":"ref19","first-page":"161","article-title":"Design and simulation of a macro-micro dual-drive high acceleration precision XY-stage for IC bonding technology","author":"jie","year":"0","journal-title":"Proc IEEE 6th Int Conf Electron Packag Technol"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2017.2723458"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2017.2758749"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/MRA.2006.250562"},{"key":"ref5","first-page":"171","article-title":"Mechanism and control of linear positioning for IC wire bonders","author":"li","year":"0","journal-title":"Proc 6th IEEE Int Conf Electron Packag Technol"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ICEPT.2018.8480586"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2016.2598812"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TII.2018.2805297"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1038\/s41928-017-0005-9"},{"key":"ref9","year":"2014","journal-title":"Smac"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/ICMA.2006.257719"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1016\/j.jsv.2015.06.024"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2017.2767519"}],"container-title":["IEEE Transactions on Industrial Electronics"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/41\/9420632\/09185033.pdf?arnumber=9185033","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,5,10]],"date-time":"2022-05-10T14:49:32Z","timestamp":1652194172000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9185033\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2021,8]]},"references-count":22,"journal-issue":{"issue":"8"},"URL":"https:\/\/doi.org\/10.1109\/tie.2020.3020018","relation":{},"ISSN":["0278-0046","1557-9948"],"issn-type":[{"value":"0278-0046","type":"print"},{"value":"1557-9948","type":"electronic"}],"subject":[],"published":{"date-parts":[[2021,8]]}}}