{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,21]],"date-time":"2026-01-21T11:17:39Z","timestamp":1768994259073,"version":"3.49.0"},"reference-count":30,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"1","license":[{"start":{"date-parts":[[2022,1,1]],"date-time":"2022-01-01T00:00:00Z","timestamp":1640995200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2022,1,1]],"date-time":"2022-01-01T00:00:00Z","timestamp":1640995200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,1,1]],"date-time":"2022-01-01T00:00:00Z","timestamp":1640995200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100013290","name":"National Key Research and Development Program of China Stem Cell and Translational Research","doi-asserted-by":"publisher","award":["2018YFF01010600"],"award-info":[{"award-number":["2018YFF01010600"]}],"id":[{"id":"10.13039\/501100013290","id-type":"DOI","asserted-by":"publisher"}]},{"name":"Science and Technology Plan Project of Guangdong Province","award":["2017B010123001"],"award-info":[{"award-number":["2017B010123001"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Ind. Electron."],"published-print":{"date-parts":[[2022,1]]},"DOI":"10.1109\/tie.2021.3050396","type":"journal-article","created":{"date-parts":[[2021,1,14]],"date-time":"2021-01-14T21:20:24Z","timestamp":1610659224000},"page":"950-959","source":"Crossref","is-referenced-by-count":14,"title":["Analysis and Compensation of Benchmark Drift of Micromachined Thermal Wind Sensor Caused by Packaging Asymmetry"],"prefix":"10.1109","volume":"69","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-5378-0966","authenticated-orcid":false,"given":"Zhenjun","family":"Wang","sequence":"first","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0002-4619-8855","authenticated-orcid":false,"given":"Zhenxiang","family":"Yi","sequence":"additional","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0001-7574-9903","authenticated-orcid":false,"given":"Run","family":"Tian","sequence":"additional","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0002-8424-6299","authenticated-orcid":false,"given":"Ming","family":"Qin","sequence":"additional","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0002-0646-7635","authenticated-orcid":false,"given":"Qing-An","family":"Huang","sequence":"additional","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0002-2608-8480","authenticated-orcid":false,"given":"Zai-Fa","family":"Zhou","sequence":"additional","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0003-1879-805X","authenticated-orcid":false,"given":"Kevin","family":"Long","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/MEMSYS.2009.4805435"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TBME.2019.2924689"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.3390\/s19061397"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.1986.350211"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2016.2630670"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2020.2984446"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2008.926703"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1016\/s0924-4247(01)00584-2"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/JMEMS.2017.2707558"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1016\/j.sna.2010.08.012"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1016\/S0925-4005(03)00109-6"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2012.2216866"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/JMEMS.2015.2464213"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/JMEMS.2019.2928317"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2019.2906192"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1016\/j.measurement.2019.05.073"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/JMEMS.2019.2941024"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1088\/0960-1317\/6\/1\/038"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/JMEMS.2020.2971017"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1088\/1361-6439\/aab6bd"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1007\/s00542-010-1026-8"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/NEMS.2018.8556920"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/SFICON.2001.968501"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2010.2083651"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2003.820324"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1016\/0924-4247(94)00789-6"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1088\/0957-0233\/7\/10\/007"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1007\/s00542-008-0665-5"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1016\/0017-9310(67)90166-4"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/TRANSDUCERS.2019.8808449"}],"container-title":["IEEE Transactions on Industrial Electronics"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/41\/9557856\/09325075.pdf?arnumber=9325075","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,1,9]],"date-time":"2024-01-09T23:43:59Z","timestamp":1704843839000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9325075\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,1]]},"references-count":30,"journal-issue":{"issue":"1"},"URL":"https:\/\/doi.org\/10.1109\/tie.2021.3050396","relation":{},"ISSN":["0278-0046","1557-9948"],"issn-type":[{"value":"0278-0046","type":"print"},{"value":"1557-9948","type":"electronic"}],"subject":[],"published":{"date-parts":[[2022,1]]}}}