{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,15]],"date-time":"2026-01-15T00:33:57Z","timestamp":1768437237710,"version":"3.49.0"},"reference-count":39,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"2","license":[{"start":{"date-parts":[[2022,2,1]],"date-time":"2022-02-01T00:00:00Z","timestamp":1643673600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2022,2,1]],"date-time":"2022-02-01T00:00:00Z","timestamp":1643673600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,2,1]],"date-time":"2022-02-01T00:00:00Z","timestamp":1643673600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100013290","name":"National Key Research and Development Program of China Stem Cell and Translational Research","doi-asserted-by":"publisher","award":["2019YFB2005702"],"award-info":[{"award-number":["2019YFB2005702"]}],"id":[{"id":"10.13039\/501100013290","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100013290","name":"National Key Research and Development Program of China Stem Cell and Translational Research","doi-asserted-by":"publisher","award":["2018YFB2003001"],"award-info":[{"award-number":["2018YFB2003001"]}],"id":[{"id":"10.13039\/501100013290","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Ind. Electron."],"published-print":{"date-parts":[[2022,2]]},"DOI":"10.1109\/tie.2021.3060677","type":"journal-article","created":{"date-parts":[[2021,2,25]],"date-time":"2021-02-25T20:37:03Z","timestamp":1614285423000},"page":"2099-2106","source":"Crossref","is-referenced-by-count":23,"title":["Micromachined Thermocouple for Rapid Detection of Ultrahigh Heat Flux at High Temperature"],"prefix":"10.1109","volume":"69","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-3163-0684","authenticated-orcid":false,"given":"Jiayu","family":"Wang","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-7329-0833","authenticated-orcid":false,"given":"Wei","family":"Tian","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yi","family":"Wang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hong","family":"Zhou","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-7780-8169","authenticated-orcid":false,"given":"Yunqian","family":"He","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yuelin","family":"Wang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-9907-0188","authenticated-orcid":false,"given":"Tie","family":"Li","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijfatigue.2008.03.038"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1016\/j.applthermaleng.2009.11.003"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1016\/j.applthermaleng.2011.03.036"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1063\/1.4731685"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1016\/j.applthermaleng.2013.07.012"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1016\/j.applthermaleng.2014.02.048"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1016\/j.applthermaleng.2013.10.066"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.2514\/1.32011"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1063\/1.1770712"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.2514\/1.T3772"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1080\/08916152.2011.609631"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1016\/j.egypro.2014.03.221"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1016\/j.applthermaleng.2016.07.164"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1063\/1.3494605"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1063\/1.3689770"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1016\/j.measurement.2014.10.056"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1088\/0957-0233\/21\/10\/105201"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijheatmasstransfer.2010.11.029"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1016\/j.fusengdes.2012.07.001"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1088\/0957-0233\/26\/2\/025303"},{"key":"ref21","first-page":"133","article-title":"Advanced Earth-to-Orbit Propulsion Technology, National Aeronautics and Space Administration, Marshall Space Flight Center","author":"Richmond","year":"1994"},{"key":"ref22","first-page":"97","article-title":"The 1992 NASA Langley Measurement Technology Conference: Measurement Technology for Aerospace Applications in High Temperature Environments","volume":"3161","author":"Singh","year":"1992"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.2514\/6.2009-5066"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1016\/j.tsf.2012.04.034"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1016\/0924-4247(91)87054-7"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1016\/0924-4247(92)80192-6"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1016\/S0924-4247(96)01409-4"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1016\/0924-4247(91)87052-5"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1016\/S0924-4247(97)80222-1"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1016\/j.vacuum.2009.05.003"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1016\/j.vacuum.2013.07.044"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/T-ED.1982.20652"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/55.192792"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1088\/0957-0233\/18\/7\/R01"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1007\/s10762-010-9635-y"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1088\/0960-1317\/23\/6\/065026"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1007\/s11465-017-0441-2"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1088\/1361-6439\/aaeafe"},{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.1109\/JMEMS.2019.2948645"}],"container-title":["IEEE Transactions on Industrial Electronics"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/41\/9594638\/09363630.pdf?arnumber=9363630","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,1,9]],"date-time":"2024-01-09T23:27:36Z","timestamp":1704842856000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9363630\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,2]]},"references-count":39,"journal-issue":{"issue":"2"},"URL":"https:\/\/doi.org\/10.1109\/tie.2021.3060677","relation":{},"ISSN":["0278-0046","1557-9948"],"issn-type":[{"value":"0278-0046","type":"print"},{"value":"1557-9948","type":"electronic"}],"subject":[],"published":{"date-parts":[[2022,2]]}}}