{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,12]],"date-time":"2026-03-12T17:49:33Z","timestamp":1773337773977,"version":"3.50.1"},"reference-count":34,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"10","license":[{"start":{"date-parts":[[2022,10,1]],"date-time":"2022-10-01T00:00:00Z","timestamp":1664582400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2022,10,1]],"date-time":"2022-10-01T00:00:00Z","timestamp":1664582400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,10,1]],"date-time":"2022-10-01T00:00:00Z","timestamp":1664582400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Ind. Electron."],"published-print":{"date-parts":[[2022,10]]},"DOI":"10.1109\/tie.2021.3123665","type":"journal-article","created":{"date-parts":[[2021,11,3]],"date-time":"2021-11-03T19:25:22Z","timestamp":1635967522000},"page":"9972-9983","source":"Crossref","is-referenced-by-count":9,"title":["Intermediate Coil-Aided Wireless Charging Via Interactive Power Transmitting With Misalignment-Tolerating Considerations"],"prefix":"10.1109","volume":"69","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-9996-8673","authenticated-orcid":false,"given":"Shyh-Jier","family":"Huang","sequence":"first","affiliation":[{"name":"Department of Electrical Engineering, National Cheng Kung University, Tainan, Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-6962-9312","authenticated-orcid":false,"given":"Tsong-Shing","family":"Lee","sequence":"additional","affiliation":[{"name":"Department of Electrical Engineering, Southern Taiwan University of Science and Technology, Tainan, Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ya-Ming","family":"Yang","sequence":"additional","affiliation":[{"name":"Taiwan Semiconductor Manufacturing Company, Ltd., Tainan, Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jeng-Yi","family":"Chen","sequence":"additional","affiliation":[{"name":"Taiwan Semiconductor Manufacturing Company, Ltd., Tainan, Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TMAG.2017.2656819"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TIA.2017.2681622"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2016.2577625"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2016.2606893"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2017.2721913"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TMAG.2019.2904086"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2020.2971140"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2019.2941709"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2020.2965476"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2017.2740944"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2019.2954906"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2019.2908604"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2019.2944194"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2019.2936325"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2019.2916231"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2019.2945304"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2020.2977199"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2017.2686301"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2019.2955299"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2020.2978532"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2020.2987906"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/JESTPE.2017.2761763"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/TTE.2016.2628796"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2020.2970780"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2020.2987132"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2017.2662067"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2018.2868727"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2019.2931260"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2016.2626498"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2018.2860560"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/LMWC.2015.2409776"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2015.2438016"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2019.2895598"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2018.2886329"}],"container-title":["IEEE Transactions on Industrial Electronics"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/41\/9768205\/09600576.pdf?arnumber=9600576","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,1,12]],"date-time":"2024-01-12T00:38:46Z","timestamp":1705019926000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9600576\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,10]]},"references-count":34,"journal-issue":{"issue":"10"},"URL":"https:\/\/doi.org\/10.1109\/tie.2021.3123665","relation":{},"ISSN":["0278-0046","1557-9948"],"issn-type":[{"value":"0278-0046","type":"print"},{"value":"1557-9948","type":"electronic"}],"subject":[],"published":{"date-parts":[[2022,10]]}}}