{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,7,4]],"date-time":"2026-07-04T16:54:27Z","timestamp":1783184067537,"version":"3.54.6"},"reference-count":24,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"5","license":[{"start":{"date-parts":[[2023,5,1]],"date-time":"2023-05-01T00:00:00Z","timestamp":1682899200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2023,5,1]],"date-time":"2023-05-01T00:00:00Z","timestamp":1682899200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,5,1]],"date-time":"2023-05-01T00:00:00Z","timestamp":1682899200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["52077187"],"award-info":[{"award-number":["52077187"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"name":"Research Grant Council, Hong Kong, China","award":["PolyU 152109\/20E"],"award-info":[{"award-number":["PolyU 152109\/20E"]}]},{"name":"Research Grant Council, Hong Kong, China","award":["152143\/18E"],"award-info":[{"award-number":["152143\/18E"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Ind. Electron."],"published-print":{"date-parts":[[2023,5]]},"DOI":"10.1109\/tie.2022.3187571","type":"journal-article","created":{"date-parts":[[2022,7,7]],"date-time":"2022-07-07T19:23:37Z","timestamp":1657221817000},"page":"4558-4569","source":"Crossref","is-referenced-by-count":7,"title":["Quantitative Analysis of Hybrid-Excited Doubly Salient Machine With Subslot Bottom PMs and Its Comparative Study"],"prefix":"10.1109","volume":"70","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-3846-0139","authenticated-orcid":false,"given":"Jifu","family":"Jiang","sequence":"first","affiliation":[{"name":"Department of Electrical Engineering, The Hong Kong Polytechnic University, Hong Kong"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-5934-616X","authenticated-orcid":false,"given":"Shuangxia","family":"Niu","sequence":"additional","affiliation":[{"name":"Department of Electrical Engineering, The Hong Kong Polytechnic University, Hong Kong"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-4000-0446","authenticated-orcid":false,"given":"Xing","family":"Zhao","sequence":"additional","affiliation":[{"name":"Department of Electronic Engineering, The University of York, York, U.K."}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2012.2208432"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2018.2833034"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TIA.2005.861910"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1049\/cp:19950865"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TMAG.2021.3073695"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TMAG.2003.816722"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ICELMACH.2018.8506773"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TMAG.2017.2712609"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TMAG.2013.2242047"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TMAG.2006.879435"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TMAG.2002.803582"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TMAG.2019.2899336"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TEC.2018.2847292"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TMAG.2015.2446951"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TEC.2015.2473175"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/ICELMACH.2018.8506869"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2019.2955418"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TMAG.2018.2887271"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TMAG.2019.2899919"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TMAG.2018.2846787"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1002\/eej.21132"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1016\/j.epsr.2013.07.011"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2020.2996140"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/TMAG.2012.2225068"}],"container-title":["IEEE Transactions on Industrial Electronics"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/41\/10005867\/09818850.pdf?arnumber=9818850","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,2,1]],"date-time":"2024-02-01T05:44:59Z","timestamp":1706766299000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9818850\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,5]]},"references-count":24,"journal-issue":{"issue":"5"},"URL":"https:\/\/doi.org\/10.1109\/tie.2022.3187571","relation":{},"ISSN":["0278-0046","1557-9948"],"issn-type":[{"value":"0278-0046","type":"print"},{"value":"1557-9948","type":"electronic"}],"subject":[],"published":{"date-parts":[[2023,5]]}}}