{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,4]],"date-time":"2026-06-04T16:11:58Z","timestamp":1780589518307,"version":"3.54.1"},"reference-count":21,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"10","license":[{"start":{"date-parts":[[2023,10,1]],"date-time":"2023-10-01T00:00:00Z","timestamp":1696118400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2023,10,1]],"date-time":"2023-10-01T00:00:00Z","timestamp":1696118400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,10,1]],"date-time":"2023-10-01T00:00:00Z","timestamp":1696118400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["52077187"],"award-info":[{"award-number":["52077187"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"name":"Research Grant Council of the Hong Kong","award":["PolyU 152143\/18E"],"award-info":[{"award-number":["PolyU 152143\/18E"]}]},{"name":"Research Grant Council of the Hong Kong","award":["PolyU 152109\/20E"],"award-info":[{"award-number":["PolyU 152109\/20E"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Ind. Electron."],"published-print":{"date-parts":[[2023,10]]},"DOI":"10.1109\/tie.2022.3224133","type":"journal-article","created":{"date-parts":[[2022,12,1]],"date-time":"2022-12-01T20:44:02Z","timestamp":1669927442000},"page":"9823-9834","source":"Crossref","is-referenced-by-count":17,"title":["Novel High-Order-Harmonic Toroidal Winding Design Approach for Double-Sided Vernier Reluctance Linear Machine"],"prefix":"10.1109","volume":"70","author":[{"ORCID":"https:\/\/orcid.org\/0000-0001-5727-8773","authenticated-orcid":false,"given":"Zhenghao","family":"Li","sequence":"first","affiliation":[{"name":"Department of Electrical Engineering, The Hong Kong Polytechnic University, Hong Kong"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-4000-0446","authenticated-orcid":false,"given":"Xing","family":"Zhao","sequence":"additional","affiliation":[{"name":"Department of Electronic Engineering, University of York, York, U.K."}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-5934-616X","authenticated-orcid":false,"given":"Shuangxia","family":"Niu","sequence":"additional","affiliation":[{"name":"Department of Electrical Engineering, The Hong Kong Polytechnic University, Hong Kong"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2017.2733492"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1049\/iet-rpg.2016.0726"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TIA.2004.834118"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TEC.2021.3070563"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TTE.2020.3033535"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TMAG.2019.2899919"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TASC.2020.2975767"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TASC.2013.2284720"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TMAG.2018.2839662"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TMAG.2018.2887271"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2018.2807397"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TMAG.2017.2661807"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TEC.2016.2538773"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2021.3104589"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2018.2838060"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2017.2740824"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TTE.2022.3147263"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2018.2816009"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2021.3072918"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TMAG.2017.2701152"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/ICEM49940.2020.9270941"}],"container-title":["IEEE Transactions on Industrial Electronics"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/41\/10103730\/09967928.pdf?arnumber=9967928","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,2,1]],"date-time":"2024-02-01T02:58:03Z","timestamp":1706756283000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9967928\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,10]]},"references-count":21,"journal-issue":{"issue":"10"},"URL":"https:\/\/doi.org\/10.1109\/tie.2022.3224133","relation":{},"ISSN":["0278-0046","1557-9948"],"issn-type":[{"value":"0278-0046","type":"print"},{"value":"1557-9948","type":"electronic"}],"subject":[],"published":{"date-parts":[[2023,10]]}}}