{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,8]],"date-time":"2026-04-08T07:46:06Z","timestamp":1775634366661,"version":"3.50.1"},"reference-count":25,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"12","license":[{"start":{"date-parts":[[2023,12,1]],"date-time":"2023-12-01T00:00:00Z","timestamp":1701388800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2023,12,1]],"date-time":"2023-12-01T00:00:00Z","timestamp":1701388800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,12,1]],"date-time":"2023-12-01T00:00:00Z","timestamp":1701388800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100019491","name":"National Natural Science Foundation of China - State Grid Corporation Joint Fund for Smart Grid","doi-asserted-by":"publisher","award":["U1966213"],"award-info":[{"award-number":["U1966213"]}],"id":[{"id":"10.13039\/501100019491","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100012226","name":"Fundamental Research Funds for the Central Universities","doi-asserted-by":"publisher","award":["2022CDJKYJH009"],"award-info":[{"award-number":["2022CDJKYJH009"]}],"id":[{"id":"10.13039\/501100012226","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["52007013"],"award-info":[{"award-number":["52007013"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100002858","name":"China Postdoctoral Science Foundation","doi-asserted-by":"publisher","award":["2022M710505"],"award-info":[{"award-number":["2022M710505"]}],"id":[{"id":"10.13039\/501100002858","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Ind. Electron."],"published-print":{"date-parts":[[2023,12]]},"DOI":"10.1109\/tie.2023.3236118","type":"journal-article","created":{"date-parts":[[2023,1,17]],"date-time":"2023-01-17T18:37:56Z","timestamp":1673980676000},"page":"12795-12805","source":"Crossref","is-referenced-by-count":15,"title":["Time-Varying Cumulative Damage Recursive Method for Power Semiconductor Devices"],"prefix":"10.1109","volume":"70","author":[{"ORCID":"https:\/\/orcid.org\/0000-0001-8418-3964","authenticated-orcid":false,"given":"Wei","family":"Lai","sequence":"first","affiliation":[{"name":"State Key Laboratory of Power Transmission Equipment & System Security and New Technology, School of Electrical Engineering, Chongqing University, Chongqing, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hanrui","family":"Li","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Power Transmission Equipment & System Security and New Technology, School of Electrical Engineering, Chongqing University, Chongqing, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hui","family":"Li","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Power Transmission Equipment & System Security and New Technology, School of Electrical Engineering, Chongqing University, Chongqing, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-7186-5704","authenticated-orcid":false,"given":"Minyou","family":"Chen","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Power Transmission Equipment & System Security and New Technology, School of Electrical Engineering, Chongqing University, Chongqing, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ran","family":"Yao","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Power Transmission Equipment & System Security and New Technology, School of Electrical Engineering, Chongqing University, Chongqing, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-9595-8478","authenticated-orcid":false,"given":"Hongjian","family":"Xia","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Power Transmission Equipment & System Security and New Technology, School of Electrical Engineering, Chongqing University, Chongqing, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Renkuai","family":"Liu","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Power Transmission Equipment & System Security and New Technology, School of Electrical Engineering, Chongqing University, Chongqing, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Anbin","family":"Liu","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Power Transmission Equipment & System Security and New Technology, School of Electrical Engineering, Chongqing University, Chongqing, China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2020.2991926"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/JESTPE.2019.2935037"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2020.3037266"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2017.2694548"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/JESTPE.2020.3021679"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/JESTPE.2019.2918941"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2012.2229472"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TIA.2011.2124436"},{"key":"ref17","doi-asserted-by":"crossref","first-page":"302","DOI":"10.1109\/TCAPT.2009.2012518","article-title":"Reliability of lead-free solder interconnections in thermal and power cycling tests","volume":"32","author":"li","year":"2009","journal-title":"IEEE Trans Compon Packag Technol"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2015.2501540"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TDMR.2012.2235836"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1016\/j.applthermaleng.2016.06.054"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2016.2546944"},{"key":"ref23","first-page":"3607","article-title":"Dynamic drift effects in GaN power transistors: Correlation to device technology and mission profile","author":"w\u00fcrfl","year":"2018","journal-title":"Proc Int Power Electron Conf"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2011.2114313"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TIA.2011.2168556"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2013.2251358"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2004.1319419"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/JESTPE.2019.2958737"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2017.2752142"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2016.2565701"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2020.2977563"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TIA.2019.2933514"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2020.3010064"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/JESTPE.2019.2928478"}],"container-title":["IEEE Transactions on Industrial Electronics"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/41\/10153933\/10018893.pdf?arnumber=10018893","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,7,3]],"date-time":"2023-07-03T18:12:12Z","timestamp":1688407932000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10018893\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,12]]},"references-count":25,"journal-issue":{"issue":"12"},"URL":"https:\/\/doi.org\/10.1109\/tie.2023.3236118","relation":{},"ISSN":["0278-0046","1557-9948"],"issn-type":[{"value":"0278-0046","type":"print"},{"value":"1557-9948","type":"electronic"}],"subject":[],"published":{"date-parts":[[2023,12]]}}}