{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,3]],"date-time":"2026-06-03T06:31:01Z","timestamp":1780468261036,"version":"3.54.1"},"reference-count":37,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"1","license":[{"start":{"date-parts":[[2024,1,1]],"date-time":"2024-01-01T00:00:00Z","timestamp":1704067200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2024,1,1]],"date-time":"2024-01-01T00:00:00Z","timestamp":1704067200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,1,1]],"date-time":"2024-01-01T00:00:00Z","timestamp":1704067200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"name":"Major Project of the New Generation of Artificial Intelligence","award":["2018AAA0102900"],"award-info":[{"award-number":["2018AAA0102900"]}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62173233"],"award-info":[{"award-number":["62173233"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100010877","name":"Shenzhen Science and Technology Innovation Commission","doi-asserted-by":"publisher","award":["JCYJ20210324094401005"],"award-info":[{"award-number":["JCYJ20210324094401005"]}],"id":[{"id":"10.13039\/501100010877","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100010877","name":"Shenzhen Science and Technology Innovation Commission","doi-asserted-by":"publisher","award":["JCYJ20220531102809022"],"award-info":[{"award-number":["JCYJ20220531102809022"]}],"id":[{"id":"10.13039\/501100010877","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100021171","name":"Basic and Applied Basic Research Foundation of Guangdong Province","doi-asserted-by":"publisher","award":["2021A1515011582"],"award-info":[{"award-number":["2021A1515011582"]}],"id":[{"id":"10.13039\/501100021171","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Ind. Electron."],"published-print":{"date-parts":[[2024,1]]},"DOI":"10.1109\/tie.2023.3243294","type":"journal-article","created":{"date-parts":[[2023,2,22]],"date-time":"2023-02-22T18:29:58Z","timestamp":1677090598000},"page":"708-717","source":"Crossref","is-referenced-by-count":21,"title":["MCSG: A Morphology Configurable Soft Gripper With Self-Adaption Modular Composite Finger"],"prefix":"10.1109","volume":"71","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-1104-2444","authenticated-orcid":false,"given":"Haiming","family":"Huang","sequence":"first","affiliation":[{"name":"Guangdong Key Laboratory of Intelligent Information Processing, Shenzhen University, Shenzhen, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Shijie","family":"Tang","sequence":"additional","affiliation":[{"name":"School of Mechatronics Engineering and Automation, Foshan University, Foshan, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-1559-0122","authenticated-orcid":false,"given":"Wenqing","family":"Chai","sequence":"additional","affiliation":[{"name":"Guangdong Key Laboratory of Intelligent Information Processing, Shenzhen University, Shenzhen, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-3546-6305","authenticated-orcid":false,"given":"Fuchun","family":"Sun","sequence":"additional","affiliation":[{"name":"Department of Computer Science and Technology, Tsinghua University, Beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-9798-408X","authenticated-orcid":false,"given":"Di'en","family":"Wu","sequence":"additional","affiliation":[{"name":"Guangdong Key Laboratory of Intelligent Information Processing, Shenzhen University, Shenzhen, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Shengyi","family":"Miao","sequence":"additional","affiliation":[{"name":"Guangdong Key Laboratory of Intelligent Information Processing, Shenzhen University, Shenzhen, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Daming","family":"Zhong","sequence":"additional","affiliation":[{"name":"Guangdong Key Laboratory of Intelligent Information Processing, Shenzhen University, Shenzhen, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Haobin","family":"Hou","sequence":"additional","affiliation":[{"name":"Guangdong Key Laboratory of Intelligent Information Processing, Shenzhen University, Shenzhen, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-5303-3899","authenticated-orcid":false,"given":"Mingjie","family":"Dong","sequence":"additional","affiliation":[{"name":"Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/LRA.2021.3098803"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1002\/adma.201303175"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/LRA.2022.3157448"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1089\/soro.2019.0082"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1108\/IR-12-2021-0299"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1089\/soro.2021.0016"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/SII46433.2020.9026003"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1089\/soro.2018.0112"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1002\/adma.201504264"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1177\/1687814020950094"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/LRA.2021.3126907"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1002\/rob.22051"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TRO.2020.3043981"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1126\/scirobotics.aav4494"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/LRA.2022.3143891"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2020.3044811"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1089\/soro.2018.0131"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/LRA.2021.3111038"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/ROBIO54168.2021.9739578"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1016\/j.robot.2018.02.020"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/TRO.2021.3060969"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/RoboSoft54090.2022.9762097"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijmecsci.2019.02.028"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/LRA.2017.2714141"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/LRA.2018.2851360"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1089\/soro.2018.0015"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/IROS.2015.7353596"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/RoboSoft51838.2021.9479341"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1016\/j.robot.2020.103427"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/TMECH.2018.2878621"},{"key":"ref8","doi-asserted-by":"crossref","first-page":"903","DOI":"10.1109\/LRA.2018.2792688","article-title":"A soft robotic gripper with gecko-inspired adhesive","volume":"3","author":"glick","year":"2018","journal-title":"IEEE Robot Autom Lett"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/LRA.2022.3149306"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2021.3053887"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1016\/j.compag.2020.105694"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ROBIO.2016.7866372"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/LRA.2021.3058914"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2019.2924860"}],"container-title":["IEEE Transactions on Industrial Electronics"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/41\/10184152\/10049758.pdf?arnumber=10049758","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,12,16]],"date-time":"2024-12-16T19:20:07Z","timestamp":1734376807000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10049758\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,1]]},"references-count":37,"journal-issue":{"issue":"1"},"URL":"https:\/\/doi.org\/10.1109\/tie.2023.3243294","relation":{},"ISSN":["0278-0046","1557-9948"],"issn-type":[{"value":"0278-0046","type":"print"},{"value":"1557-9948","type":"electronic"}],"subject":[],"published":{"date-parts":[[2024,1]]}}}