{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,12]],"date-time":"2026-05-12T04:35:27Z","timestamp":1778560527866,"version":"3.51.4"},"reference-count":47,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"11","license":[{"start":{"date-parts":[[2024,11,1]],"date-time":"2024-11-01T00:00:00Z","timestamp":1730419200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2024,11,1]],"date-time":"2024-11-01T00:00:00Z","timestamp":1730419200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,11,1]],"date-time":"2024-11-01T00:00:00Z","timestamp":1730419200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["52075221"],"award-info":[{"award-number":["52075221"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"name":"National Key Research and Development Plan","award":["2022YFB4600204"],"award-info":[{"award-number":["2022YFB4600204"]}]},{"DOI":"10.13039\/501100014219","name":"National Science Fund for Distinguished Young Scholars","doi-asserted-by":"publisher","award":["51925504"],"award-info":[{"award-number":["51925504"]}],"id":[{"id":"10.13039\/501100014219","id-type":"DOI","asserted-by":"publisher"}]},{"name":"National Major Scientific Research Instrument Development","award":["52227810"],"award-info":[{"award-number":["52227810"]}]},{"DOI":"10.13039\/501100012226","name":"Fundamental Research Funds for the Central Universities","doi-asserted-by":"publisher","award":["2023-JCXK-02"],"award-info":[{"award-number":["2023-JCXK-02"]}],"id":[{"id":"10.13039\/501100012226","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Ind. Electron."],"published-print":{"date-parts":[[2024,11]]},"DOI":"10.1109\/tie.2024.3366208","type":"journal-article","created":{"date-parts":[[2024,3,8]],"date-time":"2024-03-08T18:49:41Z","timestamp":1709923781000},"page":"15190-15199","source":"Crossref","is-referenced-by-count":17,"title":["Development of a Vibration-Assisted Micro\/Nano Scratch Tester for Evaluating the Scratch Behaviors of Materials Under Vibration Environment"],"prefix":"10.1109","volume":"71","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-3134-7042","authenticated-orcid":false,"given":"Haoxiang","family":"Wu","sequence":"first","affiliation":[{"name":"Key Laboratory of CNC Equipment Reliability, Ministry of Education, School of Mechanical and Aerospace Engineering, Jilin University, Changchun, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-3778-4457","authenticated-orcid":false,"given":"Hu","family":"Huang","sequence":"additional","affiliation":[{"name":"Key Laboratory of CNC Equipment Reliability, Ministry of Education, School of Mechanical and Aerospace Engineering, Jilin University, Changchun, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-5985-8229","authenticated-orcid":false,"given":"Zhi","family":"Xu","sequence":"additional","affiliation":[{"name":"Key Laboratory of CNC Equipment Reliability, Ministry of Education, School of Mechanical and Aerospace Engineering, Jilin University, Changchun, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-7530-4103","authenticated-orcid":false,"given":"Xuan","family":"Li","sequence":"additional","affiliation":[{"name":"Key Laboratory of CNC Equipment Reliability, Ministry of Education, School of Mechanical and Aerospace Engineering, Jilin University, Changchun, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-2795-8932","authenticated-orcid":false,"given":"Hongwei","family":"Zhao","sequence":"additional","affiliation":[{"name":"Key Laboratory of CNC Equipment Reliability, Ministry of Education, School of Mechanical and Aerospace Engineering, Jilin University, Changchun, China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1016\/j.wear.2023.205066"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1016\/j.intermet.2023.107832"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1016\/j.matdes.2022.111243"},{"key":"ref4","first-page":"1136","article-title":"Micromechanical characterization of microwave dielectric ceramic BaOSm2O35TiO2 by indentation and scratch methods","volume":"12","author":"Liu","year":"2023","journal-title":"J. Adv. Ceramics"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.3390\/ceramics6020072"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1038\/s41598-023-34085-z"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1016\/j.polymertesting.2023.108139"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1016\/j.surfcoat.2023.129817"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1016\/j.surfcoat.2023.129816"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1016\/j.apsusc.2023.157934"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1016\/j.triboint.2023.108736"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2022.3229372"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2022.3156034"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1016\/j.surfcoat.2023.129809"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1007\/s11249-011-9813-7"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1016\/j.ceramint.2023.02.059"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1016\/j.wear.2012.12.033"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1063\/1.4811779"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1016\/j.triboint.2019.106095"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1016\/j.triboint.2023.109175"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijmachtools.2020.103594"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijmachtools.2016.01.003"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1016\/j.ceramint.2020.02.262"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1016\/j.jmatprotec.2023.118091"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1016\/j.jmatprotec.2023.118094"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1016\/j.jclepro.2022.134866"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijmachtools.2014.02.002"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijmachtools.2012.09.004"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2023.3273246"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1016\/j.ceramint.2022.12.153"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijmachtools.2013.04.004"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/tie.2021.3108723"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1016\/j.apsusc.2023.157709"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1016\/j.triboint.2023.108808"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1016\/j.wear.2008.12.010"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijmecsci.2022.107597"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1016\/j.jmapro.2021.11.066"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2023.3247772"},{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2023.3332989"},{"key":"ref40","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2022.3152008"},{"key":"ref41","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2023.3299039"},{"key":"ref42","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2023.3237874"},{"key":"ref43","doi-asserted-by":"publisher","DOI":"10.1016\/j.jmatprotec.2022.117677"},{"key":"ref44","doi-asserted-by":"publisher","DOI":"10.2320\/matertrans.MT-M2023122"},{"key":"ref45","doi-asserted-by":"publisher","DOI":"10.1016\/j.wear.2023.204991"},{"key":"ref46","doi-asserted-by":"publisher","DOI":"10.1016\/0301-679X(96)00014-X"},{"key":"ref47","doi-asserted-by":"publisher","DOI":"10.1016\/j.surfcoat.2023.130023"}],"container-title":["IEEE Transactions on Industrial Electronics"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/41\/10639503\/10459334.pdf?arnumber=10459334","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,8,20]],"date-time":"2024-08-20T05:25:49Z","timestamp":1724131549000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10459334\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,11]]},"references-count":47,"journal-issue":{"issue":"11"},"URL":"https:\/\/doi.org\/10.1109\/tie.2024.3366208","relation":{},"ISSN":["0278-0046","1557-9948"],"issn-type":[{"value":"0278-0046","type":"print"},{"value":"1557-9948","type":"electronic"}],"subject":[],"published":{"date-parts":[[2024,11]]}}}